Abstract: A three-phase two-level power electronics assembly is disclosed in one form including a thermally conductive base plate, a heat dissipation unit, mounted on a first face of the base plate, connectors for three-phase AC output, chopper DC outputs, and two poles of a DC link, and a set of power electronics devices mounted on a second face of the base plate, whereby the power electronic devices are arranged within the three-phase two-level power electronics assembly in rows to provide a three phase AC output as well as chopper DC outputs and connected to the respective connectors, whereby the rows connected to the three-phase AC output and the rows connected to the chopper DC outputs are alternately arranged on the base plate. Also disclosed is a power converter, in particular a static power converter, having at least one three-phase two-level power electronics assembly as specified above.

Abstract: A three-phase two-level power electronics assembly is disclosed in one form including a thermally conductive base plate, a heat dissipation unit, mounted on a first face of the base plate, connectors for three-phase AC output, chopper DC outputs, and two poles of a DC link, and a set of power electronics devices mounted on a second face of the base plate, whereby the power electronic devices are arranged within the three-phase two-level power electronics assembly in rows to provide a three phase AC output as well as chopper DC outputs and connected to the respective connectors, whereby the rows connected to the three-phase AC output and the rows connected to the chopper DC outputs are alternately arranged on the base plate. Also disclosed is a power converter, in particular a static power converter, having at least one three-phase two-level power electronics assembly as specified above.