Abstract: A method for manufacturing at least one membrane system for a micromechanical sensor for the calorimetric detection of gases. A wafer-shaped substrate is provided. At least one reference volume is introduced from a front side into the wafer-shaped substrate with the aid of a surface or volume micromechanical process while forming a reference membrane covering the reference volume at least in some areas. At least one measuring volume, which is adjacent to the at least one reference volume, is introduced into the substrate from a back side or the front side of the wafer-shaped substrate while forming a measuring membrane. A wafer-shaped cap substrate is applied onto the front side of the wafer-shaped substrate. A membrane system and a component are described.

Abstract: A gas sensor is described for measuring a concentration of an analysis gas based on a thermal conductivity principle, including at least one analysis heating element situated on a first diaphragm for heating the analysis gas, a reference heating element situated on a second diaphragm for heating a reference gas, at least one evaluation electronics unit for measuring a resistance change of the analysis heating element caused by the analysis gas in relation to an electrical resistance of the reference heating element, the first diaphragm and the second diaphragm being situated adjacent to one another in a sensor substrate, due to a base substrate situated on one side on the sensor substrate, a measuring volume is formable between the first diaphragm and the base substrate and a reference volume is formable between the second diaphragm and the base substrate.

Abstract: A method for manufacturing at least one membrane system for a micromechanical sensor for the calorimetric detection of gases. A wafer-shaped substrate is provided. At least one reference volume is introduced from a front side into the wafer-shaped substrate with the aid of a surface or volume micromechanical process while forming a reference membrane covering the reference volume at least in some areas. At least one measuring volume, which is adjacent to the at least one reference volume, is introduced into the substrate from a back side or the front side of the wafer-shaped substrate while forming a measuring membrane. A wafer-shaped cap substrate is applied onto the front side of the wafer-shaped substrate. A membrane system and a component are described.

Abstract: A gas sensor is described that includes a planar carrier membrane; a gas-sensitive layer on the carrier membrane; a first and at least a second electrode, which each lie on the gas-sensitive layer in an electrically conductive manner; and a first electric supply line to the first electrode and a second electric supply line to the second electrode. The second electrode lies radially outside the first electrode, and the first supply line is insulated with respect to the gas-sensitive layer.

Abstract: A gas sensor is described for measuring a concentration of an analysis gas based on a thermal conductivity principle, including at least one analysis heating element situated on a first diaphragm for heating the analysis gas, a reference heating element situated on a second diaphragm for heating a reference gas, at least one evaluation electronics unit for measuring a resistance change of the analysis heating element caused by the analysis gas in relation to an electrical resistance of the reference heating element, the first diaphragm and the second diaphragm being situated adjacent to one another in a sensor substrate, due to a base substrate situated on one side on the sensor substrate, a measuring volume is formable between the first diaphragm and the base substrate and a reference volume is formable between the second diaphragm and the base substrate.

Abstract: A sensor element for a pressure sensor, includes a sensor membrane on which a defined number of piezoresistors are situated, the piezoresistors being configured in a circuit in such a way that, when there is a change in pressure an electrical change in voltage can be generated; at least two temperature measuring elements configured in relation to the sensor membrane in such a way that temperatures of the sensor membrane at positions of the piezoresistors can be measured using the temperature measuring elements, an electrical voltage present at the circuit of the piezoresistors due to a temperature gradient being capable of being compensated computationally using the measured temperatures.

Abstract: A gas sensor is described that includes a planar carrier membrane; a gas-sensitive layer on the carrier membrane; a first and at least a second electrode, which each lie on the gas-sensitive layer in an electrically conductive manner; and a first electric supply line to the first electrode and a second electric supply line to the second electrode. The second electrode lies radially outside the first electrode, and the first supply line is insulated with respect to the gas-sensitive layer.

Abstract: A micromechanical component is provided, the micromechanical component enclosing a cavity, the micromechanical component including a sensor element situated in the cavity, and the micromechanical component including a getter situated in the cavity. The micromechanical component includes a structure, situated between the sensor element and the getter, which is designed in such a way that a particle that is desorbed by the getter is sorbed onto and/or into an area of the micromechanical component that is spaced apart from the sensor element.

Abstract: A sensor element for a pressure sensor, includes a sensor membrane on which a defined number of piezoresistors are situated, the piezoresistors being configured in a circuit in such a way that, when there is a change in pressure an electrical change in voltage can be generated; at least two temperature measuring elements configured in relation to the sensor membrane in such a way that temperatures of the sensor membrane at positions of the piezoresistors can be measured using the temperature measuring elements, an electrical voltage present at the circuit of the piezoresistors due to a temperature gradient being capable of being compensated computationally using the measured temperatures.

Abstract: A micromechanical component is provided, the micromechanical component enclosing a cavity, the micromechanical component including a sensor element situated in the cavity, and the micromechanical component including a getter situated in the cavity. The micromechanical component includes a structure, situated between the sensor element and the getter, which is designed in such a way that a particle that is desorbed by the getter is sorbed onto and/or into an area of the micromechanical component that is spaced apart from the sensor element.