Patents by Inventor Tobias Simbeck

Tobias Simbeck has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor modules with semiconductor dies bonded to a metal foil
    Patent number: 10192849
    Abstract: A method of manufacturing semiconductor modules includes providing a metal composite substrate including a metal foil attached to a metal layer, the metal foil being thinner than and comprising a different material than the metal layer, attaching a first surface of a plurality of semiconductor dies to the metal foil prior to structuring the metal foil, and encasing the semiconductor dies attached to the metal foil in an electrically insulating material. The metal layer and the metal foil are structured after the semiconductor dies are encased with the electrically insulating material so that surface regions of the electrically insulating material are devoid of the metal foil and the metal layer. The electrically insulating material is divided along the surface regions devoid of the metal foil and the metal layer to form individual modules.
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: January 29, 2019
    Assignee: Infineon Technologies AG
    Inventors: Petteri Palm, Alexander Heinrich, Holger Torwesten, Tobias Simbeck
  • Semiconductor Modules with Semiconductor Dies Bonded to a Metal Foil
    Publication number: 20150228616
    Abstract: A method of manufacturing semiconductor modules includes providing a metal composite substrate including a metal foil attached to a metal layer, the metal foil being thinner than and comprising a different material than the metal layer, attaching a first surface of a plurality of semiconductor dies to the metal foil prior to structuring the metal foil, and encasing the semiconductor dies attached to the metal foil in an electrically insulating material. The metal layer and the metal foil are structured after the semiconductor dies are encased with the electrically insulating material so that surface regions of the electrically insulating material are devoid of the metal foil and the metal layer. The electrically insulating material is divided along the surface regions devoid of the metal foil and the metal layer to form individual modules.
    Type: Application
    Filed: February 10, 2014
    Publication date: August 13, 2015
    Applicant: Infineon Technologies AG
    Inventors: Petteri Palm, Alexander Heinrich, Holger Torwesten, Tobias Simbeck