Abstract: A device for producing filled containers has a transport device which is configured for transporting containers which are filled with a liquid and are closed by a closure. Furthermore, the apparatus has a penetration device which is configured for producing an opening in at least one region of the closure and/or of the container, and an application device, which applies a flowable and in particular gaseous medium to the interior of the container through this opening (or feeds the gaseous medium to this interior). Furthermore, the apparatus has a closing device which closes the opening again.

Abstract: A device for producing filled containers has a transport device which is configured for transporting containers which are filled with a liquid and are closed by a closure. Furthermore, the apparatus has a penetration device which is configured for producing an opening in at least one region of the closure and/or of the container, and an application device, which applies a flowable and in particular gaseous medium to the interior of the container through this opening (or feeds the gaseous medium to this interior). Furthermore apparatus has a closing device which closes the opening again.

Abstract: An apparatus for manufacturing filled containers includes a transport unit that is suitable and designed for transporting containers that are filled with a liquid and are closed with a closure cap. The apparatus includes a penetration unit that is suitable and designed for generating an opening in at least an area of the closure cap and/or of the container, and an application unit that applies a flowable and in particular gaseous medium onto an internal space of the container through this opening (or feeds gaseous medium into this intern space). Further the apparatus includes a closing unit that re-closes the opening.

Abstract: An apparatus for producing filled containers has a transport device which is suitable and intended for transporting containers which are filled with a liquid and are closed by a closure. Furthermore, the apparatus has a penetration device which is suitable and intended for producing an opening in at least one region of the closure and/or of the container, and an application device, which applies a flowable and in particular gaseous medium to the interior of the container through this opening (or feeds the gaseous medium to this interior). Furthermore, the apparatus has a closing device which closes the opening again.

Abstract: Various embodiments may relate to a connecting module for mechanically connecting two light strips each having at least one semiconductor light source and having at least two electrical contacts arranged in a housing, which electrical contacts each have two contact sections for making electrical contact with the light strips. The electrical contacts in each case pass through the housing with a further contact section for connection to a power supply.

Abstract: An LED module may include at least one LED, at least one first printed circuit board, on which the at least one LED is arranged, and a support element which is designed to support the at least one first printed circuit board. The support element is embodied as a heat pipe arrangement which includes at least one heat pipe.

Abstract: An FC-type optoelectronic assembly is provided that has a threaded plastic body that is adapted to mate with a threaded sleeve of an FC plug by engaging the threaded sleeve the FC plug with the threaded body of the FC-type optoelectronic assembly. The threaded plastic body is transparent to an operational wavelength of the FC-type optoelectronic assembly and has an optical element integrally formed therein. A TO-can header is housed in the threaded plastic body. A miniature PCB may be used for mounting the electrical and optoelectronic components of the TO-can header assembly on the header of the TO-can header assembly.

Abstract: Various embodiments may relate to a connecting module for mechanically connecting two light strips each having at least one semiconductor light source and having at least two electrical contacts arranged in a housing, which electrical contacts each have two contact sections for making electrical contact with the light strips. The electrical contacts in each case pass through the housing with a further contact section for connection to a power supply.

Abstract: An FC-type optoelectronic assembly is provided that has a threaded plastic body that is adapted to mate with a threaded sleeve of an FC plug by engaging the threaded sleeve the FC plug with the threaded body of the FC-type optoelectronic assembly. The threaded plastic body is transparent to an operational wavelength of the FC-type optoelectronic assembly and has an optical element integrally formed therein. A TO-can header is housed in the threaded plastic body. A miniature PCB may be used for mounting the electrical and optoelectronic components of the TO-can header assembly on the header of the TO-can header assembly.

Abstract: A molded interconnect device (MID) optical connector includes a molded plastic body and a metal retaining clip. The body has a receptacle portion shaped to receive and guide a mating optical fiber ferrule into a connected position. In the connected position, the end of a fiber retained in the ferrule is in optical alignment with an opto-electronic device in the MID optical connector. The retaining clip has one or more contact portions that extend into the receptacle portion of the body and exert a spring force upon the ferrule to retain and stabilize it in the connected position.

Abstract: A molded interconnect device (MID) optical connector includes a molded plastic body and a metal retaining clip. The body has a receptacle portion shaped to receive and guide a mating optical fiber ferrule into a connected position. In the connected position, the end of a fiber retained in the ferrule is in optical alignment with an opto-electronic device in the MID optical connector. The retaining clip has one or more contact portions that extend into the receptacle portion of the body and exert a spring force upon the ferrule to retain and stabilize it in the connected position.

Abstract: An optoelectronic surface-mounted device is provided comprising a premolded casing having a first cavity and a second cavity and a leadframe to which a first electrooptical element and a second electrooptical element are mounted. The leadframe is embedded in the premolded casing. The first cavity is adapted for providing a first electromagnetic radiation path between a first waveguide and the first electrooptical element, wherein the second cavity is adapted for providing a second electromagnetic radiation path between a second waveguide and the second electrooptical element. The first cavity and the second cavity are formed in the premolded casing to decouple electromagnetic radiation propagating along the first electromagnetic radiation path from electromagnetic radiation propagating along the second electromagnetic radiation path.

Abstract: Various embodiments of arrangements for optically coupling an optical waveguide to an optical unit of an optical module are provided. One embodiment is an optical module for optically coupling an optical waveguide to an optical unit. One such optical module comprises: a reference structure having a reference geometry that defines a first axis of symmetry; an optical unit having an optical axis along which light is transmitted or received, the optical unit positioned relative to the reference structure with an offset between the first axis of symmetry and the optical axis; and a coupling element that couples the optical unit to an optical waveguide, the coupling element having an eccentric hole which functions as a fiber guide and a structural geometry adapted to compensate for the offset between the first axis of symmetry and the optical axis.