Patents by Inventor Tobita Masayuki

Tobita Masayuki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat conductive adhesive film and manufacturing method thereof and electronic component
    Patent number: 6663969
    Abstract: A heat conductive adhesive film, wherein a magnetic field is applied to a film composition comprising boron nitride powder for orientating and solidifying the boron nitride powder in the composition in a given direction, an manufacturing method thereof, and an electronic component, characterized by that a heat radiating element and a heat conductive member are adhered by a heat conductive adhesive film wherein boron nitride powder is orientated in a given direction, presenting a high heat conductivity, an excellent heat radiation, and a good electric insulation and a high peeling-off strength.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: December 16, 2003
    Assignee: Polymatech Co., Ltd.
    Inventors: Tobita Masayuki, Shinya Tateda, Tsuneh isa Kimura, Masahumi Yamato
  • Heat conductive molded body and manufacturing method thereof and semiconductor device
    Patent number: 6660566
    Abstract: A heat conductive molded body effectively radiating heat generated from semiconductor elements, power supply or light source used for electric apparatuses, and a manufacturing method thereof and a semiconductor device excellent in heat radiation. A heat conductive molded body, wherein a diamagnetic filler having a thermal conductivity of 20 W/m·K or more is orientated in a fixed direction in high polymer, a manufacturing method of the heat conductive molded body, wherein a magnetic filed is applied to high polymer composition containing the diamagnetic filler, and the diamagnetic filler contained in the composition is orientated and hardened in a fixed direction, and a semiconductor wherein said heat conductive molded body is interposed between a semi-conductor element and a heat conductive member.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: December 9, 2003
    Assignee: Polymatech Co., Ltd.
    Inventor: Tobita Masayuki
  • Adhesion method and electronic component
    Patent number: 6649012
    Abstract: The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device 2, power source 4, light source or other components used for the electric products, and an electronic component excellent in radiation.
    Type: Grant
    Filed: December 8, 2000
    Date of Patent: November 18, 2003
    Assignee: Polymatech Co., Ltd.
    Inventors: Tobita Masayuki, Shinya Tateda, Tsunehisa Kimura, Masahumi Yamato
  • Heat conductive molded body and manufacturing method thereof and semiconductor device
    Publication number: 20020158332
    Abstract: A heat conductive molded body effectively radiating heat generated from semiconductor elements, power supply or light source used for electric apparatuses, and a manufacturing method thereof and a semiconductor device excellent in heat radiation.
    Type: Application
    Filed: April 25, 2002
    Publication date: October 31, 2002
    Applicant: POLYMATECH CO., LTD.
    Inventor: Tobita Masayuki
  • Heat conductive adhesive film and manufacturing method thereof and electronic component
    Publication number: 20020050585
    Abstract: A heat conductive adhesive film, wherein a magnetic field is applied to a film composition comprising boron nitride powder for orientating and solidifying the boron nitride powder in the composition in a given direction, an manufacturing method thereof, and an electronic component, characterized by that a heat radiating element and a heat conductive member are adhered by a heat conductive adhesive film wherein boron nitride powder is orientated in a given direction, presenting a high heat conductivity, an excellent heat radiation, and a good electric insulation and a high peeling-off strength.
    Type: Application
    Filed: August 2, 2001
    Publication date: May 2, 2002
    Inventors: Tobita Masayuki, Shinya Tateda, Tsuneh isa Kimura, Masahumi Yamato
  • Adhesion method and electronic component
    Publication number: 20010004131
    Abstract: The present invention provides an adhesion method of improving the heat conduction in a fixed direction by using a heat conductive adhesive made by blending boron nitride powder and adhesive polymer and adhering by orienting boron nitride powder in the heat conductive adhesive to the fixed direction under the magnetic atmosphere and an electronic component for effectively dissipating heat generated from semiconductor device 2, power source 4, light source or other components used for the electric products, and an electronic component excellent in radiation.
    Type: Application
    Filed: December 8, 2000
    Publication date: June 21, 2001
    Inventors: Tobita Masayuki, Shinya Tateda, Tsunehisa Kimura, Masahumi Yamato