Abstract: An apparatus and method for testing ball grid array integrated circuits (BGA ICs) including a nesting member resiliently supported on a contactor body via guide shafts. The nesting member includes alignment walls and an alignment plate defining chamfered through-holes. The alignment wall is slanted to provide rough alignment of the IC within the nesting member, and fine alignment of the IC is achieved when the solder balls extending from the IC are received in the chamfers formed in the upper surface of the alignment plate. Spring-loaded pogo pins are mounted on a circuit board and have pointed tips extending toward a lower surface of the nesting member alignment plate. When the nesting member is pushed toward the circuit board by a device handler, the pointed tips of the pogo pins extend through the through-holes and pierce the solder balls of the IC, thereby providing electrical contact between the IC and the interface apparatus.