Patents by Inventor Toby Hallam

Toby Hallam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7547648
    Abstract: This invention concerns the fabrication of nanoscale and atomic scale devices. The method involves creating one or more registration markers. Using a SEM or optical microscope to form an image of the registration markers and the tip of a scanning tunnelling microscope (STM). Using the image to position and reposition the STM tip to pattern the device structure. Forming the active region of the device and then encapsulating it such that one or more of the registration markers are still visible to allow correct positioning of surface electrodes. The method can be used to form any number of device structures including quantum wires, single electron transistors, arrays or gate regions. The method can also be used to produce 3D devices by patterning subsequent layers with the STM and encapsulating in between.
    Type: Grant
    Filed: August 20, 2004
    Date of Patent: June 16, 2009
    Assignee: Qucor Pty Ltd
    Inventors: Frank J. Ruess, Lars Oberbeck, Michelle Yvonne Simmons, K. E. Johnson Goh, Alexander Rudolf Hamilton, Mladen Mitic, Rolf Brenner, Neil Jonathan Curson, Toby Hallam
  • Publication number: 20060275958
    Abstract: This invention concerns the fabrication of nanoscale and atomic scale devices. The method involves creating one or more registration markers. Using a SEM or optical microscope to form an image of the registration markers and the tip of a scanning tunnelling microscope (STM). Using the image to position and reposition the STM tip to pattern the device structure. Forming the active region of the device and then encapsulating it such that one or more of the registration markers are still visible to allow correct positioning of surface electrodes. The method can be used to form any number of device structures including quantum wires, single electron transistors, arrays or gate regions. The method can also be used to produce 3D devices by patterning subsequent layers with the STM and encapsulating in between.
    Type: Application
    Filed: August 20, 2004
    Publication date: December 7, 2006
    Inventors: Frank Ruess, Lars Oberbeck, Michelle Simmons, K.E. Goh, Alexander Hamilton, Mladen Mitic, Rolf Brenner, Neil Curson, Toby Hallam
  • Patent number: 7097708
    Abstract: This invention concerns nanoscale products, such as electronic devices fabricated to nanometer accuracy. It also concerns atomic scale products. These products may have an array of electrically active dopant atoms in a silicon surface, or an encapsulated layer of electrically active donor atoms. In a further aspect the invention concerns a method of fabricating such products. The methods include forming a preselected array of donor atoms incorporated into silicon. Encapsulation by growing silicon over a doped surface, after desorbing the passivating hydrogen. Also, using an STM to view donor atoms on the silicon surface during fabrication of a nanoscale device, and measuring the electrical activity of the donor atoms during fabrication of a nanoscale device. Such products and processes are useful in the fabrication of a quantum computer, but could have many other uses.
    Type: Grant
    Filed: August 20, 2002
    Date of Patent: August 29, 2006
    Assignee: Qucor Pty Ltd.
    Inventors: Robert Graham Clark, Neil Jonathan Curson, Toby Hallam, Lars Oberbeck, Steven Richard Schofield, Michelle Yvonne Simmons
  • Publication number: 20040244672
    Abstract: This invention concerns nanoscale products, such as electronic devices fabricated to nanometer accuracy. It also concerns atomic scale products. These products may have an array of electrically active dopant atoms in a silicon surface, or an encapsulated layer of electrically active donor atoms. In a further aspect the invention concerns a method of fabricating such products. The methods include forming a preselected array of donor atoms incorporated into silicon. Encapsulation by growing silicon over a doped surface, after desorbing the passivating hydrogen. Also, using an STM to view donor atoms on the silicon surface during fabrication of a nanoscale device, and measuring the electrical activity of the donor atoms during fabrication of a nanoscale device. Such products and processes are useful in the fabrication of a quantum computer, but could have many other uses.
    Type: Application
    Filed: July 13, 2004
    Publication date: December 9, 2004
    Inventors: Robert Granham Clark, Neil Jonathan Curson, Toby Hallam, Lars Oberbeck, Steven Richard Schofield, Michelle Yvonnes Simmons
  • Patent number: 6247950
    Abstract: According to the present invention there is provided apparatus for removing a card from an opening in an electrical device. The apparatus comprises: a card including a semiconductor chip capable of making electrical connection with a contact in the opening and wherein the cards fits into the opening with substantially no part protruding therefrom and a tool that is adapted to effect removal of the card from the opening. This has the advantage that the card makes the appropriate internal contacts and can only be removed by authorized users. This stops theft of the card from retail outlets. In addition, the invention also prevents children and animals removing the card and damaging it in the home environment.
    Type: Grant
    Filed: March 18, 1999
    Date of Patent: June 19, 2001
    Assignees: NDS Limited, Hughes Electronics Corporation
    Inventors: Toby Hallam, Philip I. Siegel