Patents by Inventor Toby R. Linder

Toby R. Linder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Hermetically sealed MEMS device and its fabrication
    Patent number: 9140898
    Abstract: A hermetic package comprising a substrate (110) having a surface with a MEMS structure (101) of a first height (102), the substrate hermetically sealed to a cap (120) forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack (130) of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (140); the stack having a bottom metal seed film (131) adhering to the substrate with a first width (131a), and further a top metal seed film (132) adhering to the cap with a second width (132a) smaller than the first width, the top metal seed film tied to a layer (135) including gold-indium intermetallic compounds, layer (135) having a height greater than the first height.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: September 22, 2015
    Assignee: TEXAS INSTRUMENTS INCORPORATED
    Inventors: John C. Ehmke, Virgil C. Ararao, Toby R. Linder, Lance W. Barron
  • HERMETICALLY SEALED MEMS DEVICE AND ITS FABRICATION
    Publication number: 20140268295
    Abstract: A hermetic package comprising a substrate (110) having a surface with a MEMS structure (101) of a first height (102), the substrate hermetically sealed to a cap (120) forming a cavity over the MEMS structure; the cap attached to the substrate surface by a vertical stack (130) of metal layers adhering to the substrate surface and to the cap, the stack having a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance (140); the stack having a bottom metal seed film (131) adhering to the substrate with a first width (131a), and further a top metal seed film (132) adhering to the cap with a second width (132a) smaller than the first width, the top metal seed film tied to a layer (135) including gold-indium intermetallic compounds, layer (135) having a height greater than the first height.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: John C. Ehmke, Virgil C. Ararao, Toby R. Linder, Lance W. Barron