Abstract: This disclosure describes systems and methods for designing a wafer annealing chamber that combines laminar or near laminar purge gas flows across the wafer, higher flow and pressure in the upper portion of the chamber, and a specific progression of the lasing pattern relative to the purge gas laminar flow direction.

Abstract: This disclosure describes systems and methods for an annealing chamber that reduces oxygen infiltration from ambient air during the loading and unloading of a wafer. The wafer annealing chamber has an auxiliary port that is perpendicular to a plurality of exhaust ports. When the loading door is open, the plurality of exhaust ports are closed, and a pressurized zone is generated adjacent to the auxiliary port, in a throat of the annealing chamber.