Patents by Inventor Tod A. Byquist
Tod A. Byquist has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9920771Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.Type: GrantFiled: February 1, 2016Date of Patent: March 20, 2018Assignee: INTEL CORPORATIONInventors: Ben M. Broili, Tod A. Byquist, Michael S. Brazel, Joseph A. Cervantes
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Publication number: 20180059744Abstract: Embodiments herein relate to liquid cooling interfaces for field replaceable electronic components. An apparatus for cooling a computer device may include a cooling component coupled with an existing cooling system and a connector coupled with the cooling component, where the connector may be structured to removably couple the liquid cooling block to a heat conductor of a field replaceable electronic component when the field replaceable electronic component is inserted into a computer device. In some embodiments, the connector may be a clamp structured to receive the heat conductor during insertion of the field replaceable electronic component along a plane, and to provide a clamping force orthogonal to the plane. Other embodiments may be described and/or claimed.Type: ApplicationFiled: August 24, 2016Publication date: March 1, 2018Inventors: MICHAEL S. BRAZEL, BARRETT M. FANEUF, TOD A. BYQUIST, EMERY E. FREY, JUAN G. CEVALLOS
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Publication number: 20160265552Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.Type: ApplicationFiled: February 1, 2016Publication date: September 15, 2016Applicant: INTEL CORPORATIONInventors: BEN M. BROILI, TOD A. BYQUIST, MICHAEL S. BRAZEL, JOSEPH A. CERVANTES
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Patent number: 9433132Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.Type: GrantFiled: August 8, 2014Date of Patent: August 30, 2016Assignee: Intel CorporationInventors: Shankar Krishnan, Eric D. McAfee, Tod A. Byquist
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Patent number: 9354668Abstract: In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.Type: GrantFiled: July 30, 2013Date of Patent: May 31, 2016Assignee: Intel CorporationInventors: Tod A. Byquist, Peter Bristol, Michael S. Brazel, Kristin L. Weihl, Stella Latscha, Alexander D. Williams, Nicolas Kurczewski, Barry T. Dale, Robert R. Atkinson, Jr., Stephen J. Allen, Patrick S. Johnson
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Publication number: 20160044833Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.Type: ApplicationFiled: August 8, 2014Publication date: February 11, 2016Inventors: Shankar Krishnan, Eric D. McAfee, Tod A. Byquist
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Patent number: 9249803Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.Type: GrantFiled: June 30, 2010Date of Patent: February 2, 2016Assignee: INTEL CORPORATIONInventors: Ben M. Broili, Tod A. Byquist, Michael S. Brazel, Joseph A. Cervantes
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Publication number: 20150227174Abstract: In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.Type: ApplicationFiled: July 30, 2013Publication date: August 13, 2015Inventors: Tod A. Byquist, Peter Bristol, Michael S. Brazel, Kristin L. Weihl, Stella Latscha, Alexander D. Williams, Nicolas Kurczewski, Barry T. Dale, Robert R. Atkinson, JR., Stephen J. Allen, Patrick S. Johnson
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Patent number: 9086852Abstract: A computing device including fastening features. The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity. The computing device may include a lower shell comprising a lower boss protruding from the lower shell. The computing device may include a threaded insert including an insert portion received at the cavity of the upper boss. The threaded insert may include a flange portion wider than the insert portion, and a lateral movement reduction feature. The computing device may include a fastener received through the lower boss and through the threaded insert to fasten the upper shell and lower shell to each other.Type: GrantFiled: December 21, 2012Date of Patent: July 21, 2015Assignee: Intel CorporationInventors: Patrick S. Johnson, Robert R. Atkinson, Jr., Tod A. Byquist, Ben M. Broili
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Publication number: 20140177152Abstract: A computing device including fastening features. The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity. The computing device may include a lower shell comprising a lower boss protruding from the lower shell. The computing device may include a threaded insert including an insert portion received at the cavity of the upper boss. The threaded insert may include a flange portion wider than the insert portion, and a lateral movement reduction feature. The computing device may include a fastener received through the lower boss and through the threaded insert to fasten the upper shell and lower shell to each other.Type: ApplicationFiled: December 21, 2012Publication date: June 26, 2014Inventors: Patrick S. Johnson, Robert R. Atkinson, JR., Tod A. Byquist, Ben M. Broili
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Patent number: 8739392Abstract: A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.Type: GrantFiled: June 30, 2009Date of Patent: June 3, 2014Assignee: Intel CorporationInventors: Tod Byquist, Daniel P. Carter
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Patent number: 8387890Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.Type: GrantFiled: May 9, 2012Date of Patent: March 5, 2013Assignee: Intel CorporationInventors: Michael Crocker, Tod Byquist
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Publication number: 20120217316Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.Type: ApplicationFiled: May 9, 2012Publication date: August 30, 2012Inventors: Tod A. Byquist, Michael T. Crocker
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Patent number: 8191793Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.Type: GrantFiled: February 17, 2009Date of Patent: June 5, 2012Assignee: Intel CorporationInventors: Tod A. Byquist, Michael T. Crocker
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Publication number: 20120002368Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.Type: ApplicationFiled: June 30, 2010Publication date: January 5, 2012Inventors: Ben M. Broili, Tod A. Byquist, Michael S. Brazel, Joseph A. Cervantes
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Publication number: 20110019378Abstract: Composite microelectronic contacts are provided in embodiments. These may include one or more arrays of isolated conductive tines coupled to and by isolation carriers. These carriers may serve to space the conductive tines apart and to couple the isolated tines together after the tines are no longer ganged together. The isolation carriers may comprise injection molded polymers as well as stamped materials. The isolation carriers may also contain locking tabs and recesses and seating plane stops.Type: ApplicationFiled: July 27, 2009Publication date: January 27, 2011Inventors: Russell S. Aoki, Tod A. Byquist
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Publication number: 20100330823Abstract: A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.Type: ApplicationFiled: June 30, 2009Publication date: December 30, 2010Inventors: Tod Byquist, Daniel P. Carter
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Publication number: 20090228148Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.Type: ApplicationFiled: February 17, 2009Publication date: September 10, 2009Inventors: Tod A. Byquist, Michael T. Crocker
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Patent number: 7490479Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.Type: GrantFiled: March 30, 2005Date of Patent: February 17, 2009Assignee: Intel CorporationInventors: Tod A. Byquist, Michael T. Crocker
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Patent number: 7438580Abstract: In one embodiment, the present invention includes a load frame to be affixed to a primary surface of a circuit board adjacent to a socket, a load plate having a proximal portion rotatably adapted to the load frame and a distal portion having a tongue member to be locked by a shoulder member adapted to the circuit board on a side of the socket opposite to the frame, and a load lever to mate the load plate to the load frame, where the load lever is rotatable from an open position to an engaged position to lock the tongue member of the load plate under a head of the shoulder member. Other embodiments are described and claimed.Type: GrantFiled: September 20, 2007Date of Patent: October 21, 2008Assignee: Intel CorporationInventors: Russell Aoki, Tod A. Byquist, Konomi Shimada