Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.

Abstract: Embodiments herein relate to liquid cooling interfaces for field replaceable electronic components. An apparatus for cooling a computer device may include a cooling component coupled with an existing cooling system and a connector coupled with the cooling component, where the connector may be structured to removably couple the liquid cooling block to a heat conductor of a field replaceable electronic component when the field replaceable electronic component is inserted into a computer device. In some embodiments, the connector may be a clamp structured to receive the heat conductor during insertion of the field replaceable electronic component along a plane, and to provide a clamping force orthogonal to the plane. Other embodiments may be described and/or claimed.

Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.

Abstract: In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations for immersion cooling. In embodiments, an apparatus configured for immersion cooling may include a number of trays and a fluid circulation system. The number of trays may be configured to hold one or more circuit boards and may have a first opening to allow dielectric fluid to be injected into the tray, and a second opening to allow for escape of the dielectric fluid. The fluid circulation system may include a catchment area to collect the dielectric fluid that escapes from the plurality of trays and a distribution manifold coupled with the catchment area, to deliver the dielectric fluid collected in the catchment area back to the plurality of trays. Other embodiments may be described and/or claimed.

Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.

Abstract: In one embodiment chassis for an electronic device comprises a first section and a second section and an assembly to connect the first section of the chassis to the second section of the chassis for an electronic device, comprising a first hinge assembly to be coupled to the first section of the chassis for the electronic device, a second hinge assembly to be coupled to the second section of the chassis for the electronic device, a first rigid connecting member to be coupled to the first hinge assembly and the second hinge assembly, a first resistance element to provide a first rotational resistance between the first hinge assembly and a first end of the first rigid connecting member and a first resistance element to provide a second rotational resistance between the second hinge assembly and a second end of the first rigid connecting member. Other embodiments may be described.

Abstract: A computing device including fastening features. The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity. The computing device may include a lower shell comprising a lower boss protruding from the lower shell. The computing device may include a threaded insert including an insert portion received at the cavity of the upper boss. The threaded insert may include a flange portion wider than the insert portion, and a lateral movement reduction feature. The computing device may include a fastener received through the lower boss and through the threaded insert to fasten the upper shell and lower shell to each other.

Abstract: A computing device including fastening features. The computing device may include an upper shell comprising an upper boss protruding from the upper shell, the upper boss defining a cavity. The computing device may include a lower shell comprising a lower boss protruding from the lower shell. The computing device may include a threaded insert including an insert portion received at the cavity of the upper boss. The threaded insert may include a flange portion wider than the insert portion, and a lateral movement reduction feature. The computing device may include a fastener received through the lower boss and through the threaded insert to fasten the upper shell and lower shell to each other.

Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.

Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.

Abstract: Some embodiments of an apparatus and system are described for a crossflow blower motor. An apparatus may comprise one or more motors operative to control a crossflow blower. The one or more motors may comprise one or more stator assemblies having a stator coil and a bent stator. The one or more motors may be configured to control a crossflow blower arranged to generate a flow of air in a direction substantially perpendicular to an axis of rotation of the crossflow blower. Other embodiments are described.

Abstract: Composite microelectronic contacts are provided in embodiments. These may include one or more arrays of isolated conductive tines coupled to and by isolation carriers. These carriers may serve to space the conductive tines apart and to couple the isolated tines together after the tines are no longer ganged together. The isolation carriers may comprise injection molded polymers as well as stamped materials. The isolation carriers may also contain locking tabs and recesses and seating plane stops.

Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.

Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.

Abstract: In one embodiment, the present invention includes a load frame to be affixed to a primary surface of a circuit board adjacent to a socket, a load plate having a proximal portion rotatably adapted to the load frame and a distal portion having a tongue member to be locked by a shoulder member adapted to the circuit board on a side of the socket opposite to the frame, and a load lever to mate the load plate to the load frame, where the load lever is rotatable from an open position to an engaged position to lock the tongue member of the load plate under a head of the shoulder member. Other embodiments are described and claimed.

Abstract: An electronic assembly comprising one or more high performance integrated circuits includes at least one high capacity heat sink. The heat sink, which comprises a number of fins projecting substantially radially from a core, is structured to capture air from a fan and to direct the air to optimize heat transfer from the heat sink. The heat sink fins can be formed in different shapes. In one embodiment, the fins are curved. In another embodiment, the fins are bent. In yet another embodiment, the fins are curved and bent. Methods of fabricating heat sinks and electronic assemblies, as well as application of the heat sink to an electronic assembly and to an electronic system, are also described.

Abstract: In some embodiments, a system includes a socket having a first set of socket contacts exposed on a first side of the socket and a second set of socket contacts exposed on a second side of the socket; and a frame comprising at least one surface to engage two lower surfaces of the second side of the socket. The two lower surfaces may be coupled by a lower corner surface of the second side of the socket, and wherein the lower corner surface does not engage the frame.

Abstract: A method and an apparatus for removably retaining an IC in engagement with a socket such that contacts carried by the package of the IC are pressed into engagement with contacts carried by the socket by way of a retention frame with ledges positioned opposite corresponding ledges of the socket and both a load plate and load lever pivotally connected to the retention frame.