Patents by Inventor Tod Byquist

Tod Byquist has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cast grid array (CGA) package and socket
    Patent number: 8739392
    Abstract: A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.
    Type: Grant
    Filed: June 30, 2009
    Date of Patent: June 3, 2014
    Assignee: Intel Corporation
    Inventors: Tod Byquist, Daniel P. Carter
  • Method and system of advanced fan speed control
    Patent number: 8387890
    Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.
    Type: Grant
    Filed: May 9, 2012
    Date of Patent: March 5, 2013
    Assignee: Intel Corporation
    Inventors: Michael Crocker, Tod Byquist
  • Cast grid array (CGA) package and socket
    Publication number: 20100330823
    Abstract: A cast grid array (CGA) package comprises shaped solder posts which may be reflowed and connected directly to a circuit board, such as mother board, or remain in a solid state with the shape allowing them to be secured within a CGA socket which, in turn, may be connected to the a board. Embodiments of the CGA allows for a lower cost socket and package combination by using solder post to interface the socket and not requiring a loading mechanism on every socket.
    Type: Application
    Filed: June 30, 2009
    Publication date: December 30, 2010
    Inventors: Tod Byquist, Daniel P. Carter
  • Reliable land grid array socket loading device
    Publication number: 20080081489
    Abstract: An apparatus for receiving and securing a processor on a mainboard in a computer system. The apparatus includes a socket and socket loading mechanism for a land grid array. The apparatus provides a load distribution mechanism to dissipate tensile and shearing forces at the corner of the socket to protect a solder ball grid array. This improves the durability of the solder ball grid array and increases the power of the processors that may be supported by the socket.
    Type: Application
    Filed: September 29, 2006
    Publication date: April 3, 2008
    Inventors: Mike G. MacGregor, Kazimierz A. Kozyra, Tod Byquist
  • Load compensator with pre-load compression
    Patent number: 7275939
    Abstract: According to some embodiments, at least one spring element is provided for a load compensator along with a restraining portion that maintains a pre-load compression for the spring element. Moreover, at least one surface may be provided to transfer force associated with an integrated circuit and a set of electrical contacts.
    Type: Grant
    Filed: June 20, 2005
    Date of Patent: October 2, 2007
    Assignee: Intel Corporation
    Inventors: Tod Byquist, Mike S. Brazel
  • Load compensator with pre-load compression
    Publication number: 20060283182
    Abstract: According to some embodiments, at least one spring element is provided for a load compensator along with a restraining portion that maintains a pre-load compression for the spring element. Moreover, at least one surface may be provided to transfer force associated with an integrated circuit and a set of electrical contacts.
    Type: Application
    Filed: June 20, 2005
    Publication date: December 21, 2006
    Inventors: Tod Byquist, Mike Brazel
  • Method and system of advanced fan speed control
    Publication number: 20060222045
    Abstract: According to some embodiments, a method, system, and apparatus to provide thermal management control. In some embodiments, the method includes receiving, by a control mechanism, a plurality of temperature representative signals from a plurality of temperature sensors, receiving a command signal from the control mechanism by an output weighting matrix mechanism, and controlling at least one thermal cooling device with at least one weighted output signal from the output weighting matrix mechanism.
    Type: Application
    Filed: March 30, 2005
    Publication date: October 5, 2006
    Inventors: Tod Byquist, Michael Crocker
  • INTEGRATED CIRCUIT SOCKET CORNER RELIEF
    Publication number: 20050266604
    Abstract: In some embodiments, a system includes a socket having a first set of socket contacts exposed on a first side of the socket and a second set of socket contacts exposed on a second side of the socket; and a frame comprising at least one surface to engage two lower surfaces of the second side of the socket. The two lower surfaces may be coupled by a lower corner surface of the second side of the socket, and wherein the lower corner surface does not engage the frame.
    Type: Application
    Filed: May 27, 2004
    Publication date: December 1, 2005
    Inventor: Tod Byquist