Abstract: An apparatus includes a cabinet; an air-mover attached to the cabinet; a circuit board mounted in the cabinet; and an air-cooled heat sink attached in thermal contact with a heat-generating component on the circuit board. The heat sink includes a heat sink base; primary heat removal fins protruding from the heat sink base in a direction away from the circuit board; and secondary heat removal fins protruding from the heat sink base in a direction toward the circuit board. The air-mover is configured to force air between the primary heat removal fins and between the secondary heat removal fins.

Abstract: A perforated packing for capturing carbon dioxide (CO2) from a dilute gas mixture includes at least one perforated mg) structure and a feed structure. The at least one perforated structure includes a body that includes at least one wall defining an inner volume of the body and an outer surface exposed to the dilute gas mixture; and a plurality of perforations extending through the at least one wall between the inner volume and the outer surface. The feed structure is fluidly coupled to the body and operable to flow a CO2 capture solution into the inner volume of the body, through the plurality of perforations, and along the outer surface to form a liquid film of the CO2 capture solution along at least part of the outer surface, the liquid film of the CO2 capture solution configured to absorb CO2 from the dilute gas mixture.

Abstract: An approach for reducing unwanted magnetic coupling with conductive elements by keeping the localized magnetic field in a transformer's or inductors magnetic gap far away from any conductive elements is provided. The approach includes the use of spacers to keep the localized magnetic field in a transformer's or inductor's magnetic gap far away from any conductive elements to reduce unwanted magnetic coupling with those conductive elements. The spacers can be made from materials including ferrite, conductors and non-conducting elements.

Abstract: A system for removing CO2 from a dilute gas mixture includes a frame including a plurality of structural members; at least one packing section including one or more packing sheets, the one or more packing sheets including a plurality of macrostructures; one or more basins positioned at least partially below the at least one packing section, the one or more basins configured to hold a CO2 capture solution; at least one fan positioned to circulate a CO2 laden gas through the at least one packing section; and a liquid distribution system configured to flow the CO2 capture solution onto the at least one packing section.

Abstract: Implementations disclosed describe an inspection device capable of being transferred by a robot blade into a processing chamber of a manufacturing machine, the inspection device comprising an optical sensor to detect light reflected from a target located within the processing chamber, wherein the optical sensor is to output, to a processing device, a signal representative of a state of a region of a surface of the target.

Abstract: A 3D chip (or wafer) stack is provided in which a customized redistribution layer is located between each semiconductor wafer of the chip (or wafer) stack. The customized redistribution layer connects functional die sites on a first semiconductor wafer to functional die sites on a second semiconductor wafer, while by-passing non-functional die sites on the second semiconductor wafer.

Abstract: An energy dissipation activation management (EDAM) system for a vehicle includes at least one requestor system, at least one dissipator system, and an EDAM module. The at least one requestor system is configured to generate a request to burn energy stored in at least one battery pack of the vehicle. The at least one dissipator system is configured to burn energy stored in the at least one battery pack. The EDAM module is configured to receive the request, determine a status of the at least one requestor system, and based on the request and the status of the at least one requestor system, signal the at least one dissipator system to burn energy stored in the at least one battery pack.

Abstract: A semiconductor package provides a low profile connection to a bottom side of the semi-conductor package. The semi-conductor package includes a computer processor die and a substrate. The computer processor die is mounted on to a top surface of the substrate. The substrate is mounted on to a printed circuit board. A voltage regulator is coupled to the printed circuit board. A top surface of the voltage regulator is coupled to a bottom surface of the substrate. The package also includes a connector device. The connector device includes a cable configured to conduct power from an upstream source, and a low-profile connector module attached to an end of the cable. The connector module is configured to interface to a bottom surface of the voltage regulator.

Abstract: An exemplary apparatus includes a substrate; a plurality of chips mounted onto the substrate; a plurality of cold plates corresponding to the plurality of chips; means for pressing each of the cold plates toward a corresponding one of the chips; means for delivering coolant flow to the cold plates; and means for adjusting the cooling power of the plurality of cold plates, responsive to at least one sensed parameter of the plurality of chips.

Abstract: A semiconductor module includes a first semiconductor die, which comprises (i) a power support structure and (ii) a first cache region; and a second semiconductor die, which is mounted on top of the first semiconductor die and comprises (i) a logic core, which overlies and is electrically connected to the power support structure, and (ii) a second cache region, which overlies and is electrically connected to the first cache region.

Abstract: A method and a non-transitory computer readable medium having instructions stored thereon to cause one or more processors to perform a method are provided. Responsive to receiving a call to a predefined emergency number from a user device, an emergency state of the user device is forced. The forcing of the emergency state includes causing the user device to enable all radios in the user device, including any of cellular technology, Wi-Fi technology, and Bluetooth technology, to determine a location of the user device by use of remote radios and antennas at known locations in an RF distributions platform. First information associated with the user device is obtained, wherein the first information includes location information corresponding to the location of the user device. The first information is pushed to a public safety answering point.

Abstract: A broadband switch includes multi-stage electromechanical ganged stage relays. The ganged stage relays provide at least 65 dB of electrical isolation from active broadband input or active broadband output to all non-active broadband inputs. In a further aspect, the ganged stage relays provide at least 100 dB of electrical isolation from 1 kHz to 100 MHz from broadband inputs and broadband output to power inputs.

Abstract: A method for pooling resources in a mobile network includes allocating baseband resources between a plurality of virtual baseband engines supporting the mobile network, determining a change in a usage of the mobile network, and re-allocating, in response to the change in the usage of the mobile network, the baseband resources between the plurality of virtual baseband engines.

Abstract: A circuit board including: a first board material layer having a first planar surface and a first sidewall surface perpendicular to the first planar surface; a first conductive layer on the first planar surface; a second board material layer stacked on the first board material layer and having a second planar surface and a second sidewall surface perpendicular to the second planar surface; a second conductive layer on the second planar surface; and a plating on the first sidewall surface and the second sidewall surface and electrically connecting the first conductive layer and the second conductive layer.

Abstract: A power converter with co-packaged secondary field effect transistors (FETs) are described. The power converter can include a first circuit, a transformer connected to an output of the first circuit, and a second circuit connected to an output of the transformer. The second circuit can include an inductor, a first FET coupled between the transformer and the inductor, and a second FET coupled between the first FET and ground. The first FET and the second FET can be co-packaged as a single package.

Abstract: A package structure is disclosed. The package structure includes processor die connected to a top surface of a package substrate. The package structure further includes a DC-DC power converter attached to a bottom surface of the package substrate. The DC-DC power converter is located at least within an open area of an interconnect component that connects the bottom surface of the package substrate and a top surface of a motherboard.

Abstract: A server drawer comprising a plurality of Printed Circuit Boards (PCBs) respectively containing heat-generating electronic devices. The server drawer further comprises a plurality of fans configured to convectively dissipate heat from the heat-generating electronic devices. The server drawer further comprises internal partitions isolating airflow between respective PCBs of the plurality of PCBs.

Abstract: An apparatus comprising chips mounted to a substrate, wherein one or more of the chips comprises a first height and one or more of the chips comprises a second height, wherein the first height is taller than the second height. A cold plate located above the plurality of chips, wherein the cold plate includes a bottom wall and a top wall, wherein the cold plate includes a plurality of cooling fins that are attached to the bottom wall of the cold plate, wherein the cold plate accommodates the plurality of chips, wherein the chips includes chips having the first height and the second height.

Abstract: A structure is provided for a structure for providing electrical connections across a connection interface is provided. The structure may include one or more signal connections, a plurality of reference connections, and one or more high-pass filters. One or more of the reference connections is configured to connect a first reference voltage in a first region on a first side of the interface with a second reference voltage in a second region on a second side of the interface. One or more of the reference connections in a first class of reference connections is coupled one or more of the reference voltages through the one or more high-pass filters, and low-bandwidth information is communicated across the one or more reference connections in the first class of reference connection.

Abstract: A passive circuit element is disclosed. The passive circuit element includes an array of conductive pads arranged on a substrate such that a gap is formed between each of the conductive pads. The passive circuit element further includes a first wire electrically connected to a first conductive pad of the array of conductive pads such that the first wire passes through a first gap formed between a second conductive pad and a third conductive pad. The passive circuit element further includes a second wire electrically connected to a fourth conductive pad of the array of conductive pads such that the second wire passes through the first gap. At least one of the second and third conductive pads has a substantially planar side facing toward the first gap.