Abstract: Various embodiments utilize a real-time instant messaging or presence based communications system as a mechanism to remotely control the operation, programming, and/or review of media content on a device or system such as a television, media center, gaming device, digital video recorder and the like. In addition, the use of the instant messaging or presence based communication system opens up various social networking options for users. For example, users can, if allowed, gain access to the viewing habits of individuals in their contact list and exchange information with one another to provide a rich, robust sharing environment.

Abstract: A method and apparatus for imprinting substrates. One embodiment of the invention provides a microtool having a sidewall on one or both plates. The sidewalls help prevent excess dielectric material from forming on the microtool plates or the substrate. For one embodiment of the invention, each microtool plate has a sidewall formed thereon. Upon application of pressure, the sidewalls contact each other, thus reducing or eliminating flexing of the microtool plates.

Abstract: An interactive agent, or bot, is disclosed which is capable of formatting information for optimal presentation depending at least in part on the functionality of the endpoint device receiving the information. The bot may operate as part of an IM application interface which provides protocols for network communications between a user endpoint device and the bot.

Abstract: Advertisements are incorporated into alerts generated for a user. A server-side alert delivery system can be used by a partner server, client device, or other server to deliver an alert to a user about some event the user has requested. A relevant advertisement is selected based upon the content of the alert and other data. In some cases, the time of day of the alert and/or the location to which the alert is delivered may be considered in selecting the advertisement. The alert may be provided to a user through different services and devices, including an instant messaging service, mail service, or through a mobile device.

Abstract: A system to imprint patterns on impressionable materials by generating a pressure differential within an imprinting chamber by creating a substantial vacuum in an imprinting area is provided. This system can be used to create conductive traces in a substrate onto which integrated circuit chips and dies can be mounted to create semiconductor packages. A low pressure line evacuates air from a material receiving area of a vessel creating a pressure differential across pistons in the vessel thereby causing the pistons to press microtools into impressionable material layers. The low pressure line helps the microtools conform to any thickness variations in the imprinted material and prevents air pockets from developing between the microtool and the imprinted material.

Abstract: Electronic contacts, including spherical cores and attachment layers on the cores, are provided for attaching a semiconductor package substrate to a printed circuit board. The spherical cores are made of high-melting-temperature copper, and the attachment layers are made of a low-melting-temperature eutectic. The attachment layers melt in a reflow process. The spherical cores do not melt, and thereby control movement or “collapsing” of the package substrate toward the printed circuit board.

Abstract: A micro tool alignment apparatus and method of use is described herein.

Abstract: A method and apparatus for imprinting substrates. One embodiment of the invention provides a microtool having a sidewall on one or both plates. The sidewalls help prevent excess dielectric material from forming on the microtool plates or the substrate. For one embodiment of the invention, each microtool plate has a sidewall formed thereon. Upon application of pressure, the sidewalls contact each other, thus reducing or eliminating flexing of the microtool plates.

Abstract: Electronic contacts, including spherical cores and attachment layers on the cores, are provided for attaching a semiconductor package substrate to a printed circuit board. The spherical cores are made of high-melting-temperature copper, and the attachment layers are made of a low-melting-temperature eutectic. The attachment layers melt in a reflow process. The spherical cores do not melt, and thereby control movement or “collapsing” of the package substrate toward the printed circuit board.