Abstract: In one illustrative embodiment, an isolator for an inertial measurement unit (IMU) is provided that includes an inner ring with an outer surface and an outer ring with an inner surface. The inner ring of the isolator may have a recessed portion and the outer ring may have a protruding portion, wherein the protruding portion is interlocked with at least part of the recessed portion to prevent excessive rotation of the inner ring relative to the outer ring during high rotational events. The isolator may also include an elastomer position between at least a portion of the inner ring and at least a portion of the outer ring to provide enhanced vibration and/or shock isolation during operation of the IMU, and to provide dampening of shock events during bottoming out of isolator during high shock events.

Abstract: An inertial measurement unit (IMU) is provided that includes a container that defines a cavity. A sensor suit or ISA having a housing is provided in the container of the IMU. A dampening material is provided between the housing of the ISA and the container of the IMU. The dampening material may be applied by coating, spraying, or dipping, or may be separately molded and then inserted, if desired. A sway space may also be provided between the ISA and the IMU container.

Abstract: A three-dimensional PWB is provided that may include two or more layers stacked together forming a top surface, a bottom surface, and one or more side surfaces, and one or more solder pad situated on at least one of the one or more side surfaces. The one or more solder pads may include exposed voids in the one or more side surfaces. In some cases, the top surface and/or the bottom surface may have one or more solder pad. The one or more solder pads on at least one of the one or more side surfaces may be electrically connected to the one or more solder pads on the top surface and/or the bottom surface. In the illustrative PWB, the top surface and/or the bottom surface may be adapted to be mounted with an inertial sensor. The one or more side surfaces may be adapted to be mounted to a printed wiring board.

Abstract: Methods and systems for controlling the internal dampening of MEMS sensors is provided. In one illustrative embodiment, a MEMS sensor is provide that can be tunable to a desired Q value, and the Q value may be held relatively constant over the expected life of the sensor. The MEMS sensor package may include a chamber that houses a MEMS sensor. An inert gas may be provided in the chamber at a desired or specified pressure, wherein the inert gas may be backfilled into the chamber after the chamber is evacuated. The pressure of the inert gas may be set to achieve a desired Q value.