Abstract: Methods and systems for monitoring use, determining risk, and pricing insurance policies for a vehicle having one or more autonomous or semi-autonomous operation features are provided. According to certain aspects, an identity of a vehicle operator may be determined and a vehicle operator profile and/or operating data regarding autonomous operation features of the vehicle may be received after the vehicle operator opts into a rewards program and agrees to share their data. Autonomous operation and vehicle operator risk levels associated with operation of the autonomous or semi-autonomous vehicle may be determined. Based upon the risk levels and/or comparison thereof, one or more autonomous operation features may be disengaged. A preparedness level of the vehicle operator to assume or reassume control of operating the vehicle is determined prior to disengagement. If satisfactory, an alert is presented to the vehicle operator prior to disengagement of the autonomous operation features.

Abstract: According to certain aspects, a computer-implemented method for operating an autonomous or semi-autonomous vehicle may be provided. With the customer's permission, an identity of a vehicle operator may be identified and a vehicle operator profile may be retrieved. Operating data regarding autonomous operation features operating the vehicle may be received from vehicle-mounted sensors. When a request to disable an autonomous feature is received, a risk level for the autonomous feature is determined and compared with a driver behavior setting for the autonomous feature stored in the vehicle operator profile. Based upon the risk level comparison, the autonomous vehicle retains control of vehicle or the autonomous feature is disengaged depending upon which is the safer driver—the autonomous vehicle or the vehicle human occupant. As a result, unsafe disengagement of self-driving functionality for autonomous vehicles may be alleviated.

Abstract: A method and apparatus for directing a process gas through a wafer processing apparatus, such as a vapor deposition chamber is provided. The apparatus comprises a pumping plate (4) defining a central opening (62) surrounding the wafer (W) and having an upper surface (64) facing the processing chamber (12) and a opposite, lower surface (66) facing a pumping channel (14). The plate defines a plurality of circumferentially spaced gas holes (90) extending between the first and second surfaces for discharging process gases from the chamber into the pumping channel. The gas holes are essentially straight so that they flow directly through the pumping plate, thereby minimizing the residence time of the gases within the processing chamber and reducing the time required to clean the gas holes. In addition, the gas holes extend in a radially outward direction relative to the central opening to substantially uniformly discharge the gas from the processing chamber.