Abstract: An apparatus for testing integrated circuits (ICs) , includes a first thermal contact structure having a first surface to interface with a heat source and an opposing second surface to interface with a device under test (DUT). A second thermal contact structure is above the first thermal contact structure and separated therefrom by a variable-resistance thermal interface (VRTI) structure operable to couple or decouple the first and second thermal contact structures from one another. The VRTI structure has a maximal thermal conductivity associated with a first state, and a minimal thermal conductivity associated with a second state.

Abstract: A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.

Abstract: An apparatus for testing integrated circuits (ICs), comprising a first thermal contact structure having a first surface to interface with a heat source, the first surface is opposite a second surface. A second thermal contact structure is above the first thermal contact structure and separated therefrom. The second thermal contact structure has a third surface to interface with a cold mass. The third surface is opposite a fourth surface, and the fourth surface is opposite the second surface. A variable-resistance thermal interface (VRTI) structure is between the first and second thermal contact structures. The VRTI structure has a maximal thermal conductivity associated with a first state, and a minimal thermal conductivity associated with a second state.

Abstract: A conformable heat sink interface for an integrated circuit package comprises a mounting plate having a first surface and a deformable membrane having a portion bonded to a second surface of the plate. A cavity is between the second surface of the plate and the deformable membrane. A flowable heat transfer medium is within the cavity. The flowable heat transfer medium has a thermal conductivity of not less than 30 W/m K. The deformable membrane is to conform to a three-dimensional shape of an IC package and the mounting plate has a second surface that is to be adjacent to a heat sink base.

Abstract: A turbine blade airfoil assembly includes a cooling air passage. The cooling air passage includes a plurality of impingement openings that are isolated from at least one adjacent impingement opening. The cooling air passage is formed and cast within a turbine blade assembly through the use of a single core. The single core forms the features required to fabricate the various separate and isolated impingement openings. The isolation and combination of impingement openings provide for the augmentation of convection and film cooling and provide the flexibility to tailor airflow on an airfoil to optimize thermal performance of an airfoil.

Abstract: A turbine blade airfoil assembly includes a cooling air passage. The cooling air passage includes a plurality of impingement openings that are isolated from at least one adjacent impingement opening. The cooling air passage is formed and cast within a turbine blade assembly through the use of a single core. The single core forms the features required to fabricate the various separate and isolated impingement openings. The isolation and combination of impingement openings provides for the augmentation of convection and film cooling and provide the flexibility to tailor airflow on an airfoil to optimize thermal performance of an airfoil.

Abstract: A turbine blade airfoil assembly includes a cooling air passage. The cooling air passage includes a plurality of impingement openings that are isolated from at least one adjacent impingement opening. The cooling air passage is formed and cast within a turbine blade assembly through the use of a single core. The single core forms the features required to fabricate the various separate and isolated impingement openings. The isolation and combination of impingement openings provides for the augmentation of convection and film cooling and provide the flexibility to tailor airflow on an airfoil to optimize thermal performance of an airfoil.

Abstract: The diffusion opening in the cooling hole of an airfoil is formed by an EDM process in which the outwardly flaring sidewalls of the opening, rather then having surfaces that are approximated to be smooth by having many small ribs formed therein, are formed with a relatively few ribs with both longitudinally extending and radially extending surfaces that are substantially greater in dimension than those as normally formed. In this manner, the machining process is simplified and expedited, while at the same time, the cooling efficiency is increased.

Abstract: A turbine blade airfoil assembly includes a cooling air passage. The cooling air passage includes a plurality of impingement openings that are isolated from at least one adjacent impingement opening. The cooling air passage is formed and cast within a turbine blade assembly through the use of a single core. The single core forms the features required to fabricate the various separate and isolated impingement openings. The isolation and combination of impingement openings provides for the augmentation of convection and film cooling and provide the flexibility to tailor airflow on an airfoil to optimize thermal performance of an airfoil.

Abstract: A cast vane cluster with enhanced cooling contains an inner and an outer platform and at least two airfoils for directing a primary fluid stream axially rearward. A duct is bounded by inner, an outer endwall surfaces, and adjacent airfoil fluid directing surfaces. One or more cooling holes in the duct are drilled using an electrodischarge machine (EDM) method without a line of sight from the drilling equipment to the cooling hole location. One or more cooling holes, located in portions of the duct, may not be visible when viewed from an external location. Additionally, one or more cooling holes may only have an outlet cross sectional area visible when viewed along a longitudinal axis from an external location.

Abstract: A hole-drilling guide for directing a flexible hole-drilling instrument includes; a body made of an electrically insulating material, at least one inlet aperture penetrating a face of the body, at least one exit aperture penetrating a face of the body and a hollow, nonlinear raceway linking the inlet and exit apertures.

Abstract: A bicycle cantilever brake for being applied to a wheel rim of a bicycle. Specifically, there is a seat (7) fixedly mounted to the bicycle. There is a brake arm (2), rotatably mounted at a first end to the seat. There is also a brake shoe assembly, rotatably mounted to a mid-section of the brake arm. Uniquely, there is a flexible member (5), non-rotatably coupled to the seat and the brake shoe assembly, whereby the flexible member maintains an aligning axis (90) of the brake shoe assembly in a parallel orientation during successive stages of actuation.