Patents by Inventor Todd Crandell
Todd Crandell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11690172Abstract: Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.Type: GrantFiled: February 25, 2022Date of Patent: June 27, 2023Assignee: Metrospec Technology, L.L.C.Inventors: Henry V. Holec, Wm. Todd Crandell
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Publication number: 20220394847Abstract: Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.Type: ApplicationFiled: February 25, 2022Publication date: December 8, 2022Inventors: Henry V. Holec, Wm. Todd Crandell
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Publication number: 20220159837Abstract: Embodiments disclosed herein include to interconnectable circuit boards that can be constructed into three-dimensional shapes for use as lighting sources. An interconnectable circuit board array is included having a plurality of circuit board assemblies. The circuit board assemblies can include a first longitudinal edge, and a second longitudinal edge, and a plurality of bendable lateral board to board connectors. The plurality of bendable lateral board to board connectors are configured to provide electrical communication between a first circuit board from amongst the plurality of circuit board assemblies and a second circuit board from amongst the plurality of circuit board assemblies. Longitudinal edges of the first circuit board and of the second circuit board define a gap between the first circuit board and the second circuit board. The gap being bridged by at least one of the lateral board to board connectors. Other embodiments are also included herein.Type: ApplicationFiled: October 22, 2021Publication date: May 19, 2022Inventors: Henry V. Holec, Brian Hillstrom, Wm. Todd Crandell
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Patent number: 11304308Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: GrantFiled: November 27, 2019Date of Patent: April 12, 2022Assignee: Metrospec Technology, L.L.C.Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
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Patent number: 11266014Abstract: Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.Type: GrantFiled: June 24, 2019Date of Patent: March 1, 2022Assignee: Metrospec Technology, L.L.C.Inventors: Henry V. Holec, Wm. Todd Crandell
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Patent number: 10905004Abstract: In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.Type: GrantFiled: May 26, 2016Date of Patent: January 26, 2021Assignee: Metrospec Technology, L.L.C.Inventors: Henry V. Holec, Wm. Todd Crandell
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Publication number: 20200275556Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: ApplicationFiled: November 27, 2019Publication date: August 27, 2020Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
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Publication number: 20200053875Abstract: Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.Type: ApplicationFiled: June 24, 2019Publication date: February 13, 2020Inventors: Henry V. Holec, Wm. Todd Crandell
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Patent number: 10499511Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: GrantFiled: August 14, 2017Date of Patent: December 3, 2019Assignee: Metrospec Technology, L.L.C.Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
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Publication number: 20190301713Abstract: A ceiling grid system formed of struts has a plurality of elongate insert light units. The grid system suspended from the ceiling and comprising a multiplicity of steel elongate channels (struts) arranged in the grid. The channels having a downwardly directed U-shape and defining an opening and an open channel interior, the channel having opposing J-shaped wall portions, each wall portion with an inwardly directed curved lip portion defining a gap width therebetween the two wall portions. The elongate insert light units seated within one of the steel elongate channels, each insert light unit having an elongate body with a light emitting side, each insert light unit comprising a housing, and a strip of light emitting diodes, and a transmission portion at the light emitting side, the body retained in the interior of the channel, each light unit removable and replaceable with the respective channel.Type: ApplicationFiled: February 4, 2019Publication date: October 3, 2019Inventors: William Todd Crandell, Benjamin S. Arriola
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Patent number: 10334735Abstract: Embodiments of the invention include LED lighting systems and methods. For example, in some embodiments, an LED lighting system is included. The LED lighting system can include a flexible layered circuit structure that can include a top thermally conductive layer, a middle electrically insulating layer, a bottom thermally conductive layer, and a plurality of light emitting diodes mounted on the top layer. The LED lighting system can further include a housing substrate and a mounting structure. The mounting structure can be configured to suspend the layered circuit structure above the housing substrate with an air gap disposed in between the bottom thermally conductive layer of the flexible layered circuit structure and the housing substrate. The distance between the layered circuit structure and the support layer can be at least about 0.5 mm. Other embodiments are also included herein.Type: GrantFiled: August 22, 2012Date of Patent: June 25, 2019Assignee: Metrospec Technology, L.L.C.Inventors: Henry V. Holec, Wm. Todd Crandell
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Patent number: 10197254Abstract: A ceiling grid system formed of struts has a plurality of elongate insert light units. The grid system suspended from the ceiling and comprising a multiplicity of steel elongate channels (struts) arranged in the grid. The channels having a downwardly directed U-shape and defining an opening and an open channel interior, the channel having opposing J-shaped wall portions, each wall portion with an inwardly directed curved lip portion defining a gap width therebetween the two wall portions. The elongate insert light units seated within one of the steel elongate channels, each insert light unit having an elongate body with a light emitting side, each insert light unit comprising a housing, and a strip of light emitting diodes, and a transmission portion at the light emitting side, the body retained in the interior of the channel, each light unit removable and replaceable with the respective channel.Type: GrantFiled: February 9, 2018Date of Patent: February 5, 2019Assignee: Walthill Opportunities, L.L.C.Inventors: William Todd Crandell, Benjamin S. Arriola
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Publication number: 20180224103Abstract: A ceiling grid system formed of struts has a plurality of elongate insert light units. The grid system suspended from the ceiling and comprising a multiplicity of steel elongate channels (struts) arranged in the grid. The channels having a downwardly directed U-shape and defining an opening and an open channel interior, the channel having opposing J-shaped wall portions, each wall portion with an inwardly directed curved lip portion defining a gap width therebetween the two wall portions. The elongate insert light units seated within one of the steel elongate channels, each insert light unit having an elongate body with a light emitting side, each insert light unit comprising a housing, and a strip of light emitting diodes, and a transmission portion at the light emitting side, the body retained in the interior of the channel, each light unit removable and replaceable with the respective channel.Type: ApplicationFiled: February 9, 2018Publication date: August 9, 2018Inventors: William Todd Crandell, Benjamin S. Arriola
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Publication number: 20180063968Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: ApplicationFiled: August 14, 2017Publication date: March 1, 2018Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
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Patent number: 9736946Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: GrantFiled: October 3, 2014Date of Patent: August 15, 2017Assignee: Metrospec Technology, L.L.C.Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
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Publication number: 20170055346Abstract: In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.Type: ApplicationFiled: May 26, 2016Publication date: February 23, 2017Inventors: Henry V. Holec, Wm. Todd Crandell
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Patent number: 9357639Abstract: In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.Type: GrantFiled: February 27, 2015Date of Patent: May 31, 2016Assignee: Metrospec Technology, L.L.C.Inventors: Henry V. Holec, Wm. Todd Crandell
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Patent number: 9341355Abstract: A layered structure for use with a high power light emitting diode system comprises an electrically insulating intermediate layer interconnecting a top layer and a bottom layer. The top layer, the intermediate layer, and the bottom layer form an at least semi-flexible elongate member having a longitudinal axis and a plurality of positions spaced along the longitudinal axis. The at least semi-flexible elongate member is bendable laterally proximate the plurality of positions spaced along the longitudinal axis to a radius of at least 6 inches, twistable relative to its longitudinal axis up to 10 degrees per inch, and bendable to conform to localized heat sink surface flatness variations having a radius of at least 1 inch. The top layer is pre-populated with electrical components for high wattage, the electrical components including at least one high wattage light emitting diode at least 1.0 Watt per 0.8 inch squared.Type: GrantFiled: August 30, 2013Date of Patent: May 17, 2016Assignee: Metrospec Technology, L.L.C.Inventors: Wm. Todd Crandell, Anthony Mitchell Johnson, Tony Stephen Schweitzer, H. Vic Holec
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Publication number: 20150189765Abstract: Embodiments of the invention include flexible circuit board interconnections and methods regarding the same. In an embodiment, the invention includes a method of connecting a plurality of flexible circuit boards together comprising the steps applying a solder composition between an upper surface of a first flexible circuit board and a lower surface of a second flexible circuit board; holding the upper surface of the first flexible circuit board and the lower surface of the second flexible circuit board together; and reflowing the solder composition with a heat source to bond the first flexible circuit board and the second flexible circuit board together to form a flexible circuit board strip having a length longer than either of the first flexible circuit board or second flexible circuit board separately.Type: ApplicationFiled: October 3, 2014Publication date: July 2, 2015Inventors: Henry V. Holec, Wm. Todd Crandell, Eric Henry Holec
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Publication number: 20150173183Abstract: In some embodiments, an interconnectable circuit board may include one or more of the following features: (a) a first electrically conductive pad located on a top of the circuit board, (b) a plated through hole on the conductive pad which passes through the circuit board, (c) a second electrically conductive pad coupled to the plated through hole; the second conductive pad capable of being electrically connected to a third electrically conductive pad attached to a top of a second interconnectable circuit board, (d) cut marks indicating safe locations for separating the circuit board, and (e) a second cut mark adjacent to the first cut mark where the area between the first and second cut mark can be utilized to make a safe cut through the circuit board.Type: ApplicationFiled: February 27, 2015Publication date: June 18, 2015Inventors: Henry V. Holec, Wm. Todd Crandell