Patents by Inventor Todd D. Ward

Todd D. Ward has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-layered, shielded and grounded cables and related methods
    Patent number: 11735338
    Abstract: Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: August 22, 2023
    Assignee: Molex, LLC
    Inventors: Jared D. Sullivan, Michael McGee, Eran J. Jones, David Gader, Andrew J. Wehrli, Todd D. Ward, Gianni R. Bardella, Ayman Isaac, Darian Schulz
  • MULTI-LAYERED, SHIELDED AND GROUNDED CABLES AND RELATED METHODS
    Publication number: 20220384069
    Abstract: Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
    Type: Application
    Filed: August 9, 2022
    Publication date: December 1, 2022
    Applicant: Molex, LLC
    Inventors: Jared D. SULLIVAN, Michael MCGEE, Eran J. JONES, David GADER, Andrew J. WEHRLI, Todd D. Ward, Gianni R. BARDELLA, Ayman ISAAC, Darian SCHULZ
  • MULTI-LAYERED, SHIELDED AND GROUNDED CABLES AND RELATED METHODS
    Publication number: 20210217541
    Abstract: Data/telecommunication cables that include one or more layers of an integral, bonded electromagnetic shield are described. The shield may be configured to form an electrical ground path.
    Type: Application
    Filed: January 14, 2021
    Publication date: July 15, 2021
    Applicant: Molex, LLC
    Inventors: Jared D. SULLIVAN, Michael MCGEE, Eran J. JONES, David GADER, Andrew J. WEHRLI, Todd D. Ward, Gianni R. BARDELLA, Ayman ISAAC, Darian SCHULZ
  • High voltage interface module
    Patent number: 6937026
    Abstract: The present invention provides a voltage conditioning interface module to condition an electrical signal locally. This module receives the unsafe electrical signal at an input port. This input port is electrically coupled to an external sampling point on an electrical circuit or system under test. A conditioning circuit having both a voltage reducing circuit and a voltage limiting circuit provides a reduced voltage. The voltage limiting circuit is in parallel with the output terminals that output the reduced voltage. This arrangement ensures that when a circuit element within the voltage reducing circuit fails, an unsafe condition does not exist across these terminals.
    Type: Grant
    Filed: September 11, 2003
    Date of Patent: August 30, 2005
    Assignee: Lockheed Martin Corporation
    Inventors: Ronnie J. Lindley, Todd D. Ward