Patents by Inventor Todd Dietsch
Todd Dietsch has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240096581Abstract: A method for producing an arc quenching fuse filler including providing a conventional fuse filler material, mixing a binder agent with the conventional fuse filler material, mixing an arc quenching promotor with the conventional fuse filler material and binder agent, and curing the binder agent, whereby granules of the arc quenching promotor are bound to granules of the conventional fuse filler material.Type: ApplicationFiled: October 26, 2020Publication date: March 21, 2024Applicant: Littelfuse, Inc.Inventors: Chun-Kwan Tsang, Gordon Todd Dietsch, Irma Valeriano Santos
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Patent number: 11508542Abstract: A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.Type: GrantFiled: November 18, 2021Date of Patent: November 22, 2022Assignee: Littelfuse, Inc.Inventors: Irma Valeriano Santos, G. Todd Dietsch
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Patent number: 11437212Abstract: A surface mount device chip fuse including a dielectric substrate, electrically conductive first and second upper terminals disposed on a top surface of the dielectric substrate and defining a gap therebetween, a fusible element formed of solder disposed on the top surface of the dielectric substrate, within the gap, bridging the first and second upper terminals, and electrically conductive first and second lower terminals disposed on a bottom surface of the dielectric substrate and electrically connected to the first and second upper terminals, respectively, wherein a material of the dielectric substrate exhibits a de-wetting characteristic relative to the solder from which the fusible element is formed.Type: GrantFiled: August 6, 2021Date of Patent: September 6, 2022Assignee: Littelfuse, Inc.Inventors: Marko Arciaga, Gordon Todd Dietsch, Roel Santos Retardo, Deepak Nayar
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Publication number: 20220122799Abstract: A fuse including an electrically insulating, tubular fuse body, electrically conductive first and second endcaps disposed over opposing ends of the fuse body, a fusible element extending through the fuse body and connecting the first endcap to the second endcap, the fusible element having a central portion adapted to melt and separate upon an overcurrent condition in the fuse, and first and second arc barriers disposed on the fusible element on opposing sides of the central portion, the first and second arc barriers formed of a silicone composition that includes an arc quenching filler suspended in a silicone resin.Type: ApplicationFiled: August 27, 2021Publication date: April 21, 2022Applicant: Littelfuse, Inc.Inventors: Chun-Kwan Tsang, Todd Dietsch
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Publication number: 20220076913Abstract: A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.Type: ApplicationFiled: November 18, 2021Publication date: March 10, 2022Applicant: Littelfuse, Inc.Inventors: Irma Valeriano Santos, G. Todd Dietsch
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Patent number: 11217415Abstract: A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.Type: GrantFiled: September 17, 2020Date of Patent: January 4, 2022Assignee: Littelfuse, Inc.Inventors: Irma Valeriano Santos, G. Todd Dietsch
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Publication number: 20210090839Abstract: A high breaking capacity chip fuse including a bottom insulative layer, a first intermediate insulative layer, a second intermediate insulative layer, and a top insulative layer disposed in a stacked arrangement in the aforementioned order, a fusible element disposed between the first and second intermediate insulative layers and extending between electrically conductive first and second terminals at opposing longitudinal ends of the bottom insulative layer, the first intermediate insulative layer, the second intermediate insulative layer, and the top insulative layer, wherein the first and second intermediate insulative layers are formed of porous ceramic.Type: ApplicationFiled: September 17, 2020Publication date: March 25, 2021Applicant: Littelfuse, Inc.Inventors: Irma Valeriano Santos, G. Todd Dietsch
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Patent number: 10847335Abstract: A disc fuse including an electrically insulating substrate having a via formed therethrough extending between a first surface and a second surface of the substrate, an electrically conductive first terminal disposed on the first surface of the substrate, and an electrically conductive second terminal disposed on the second surface of the substrate, the second terminal including an outer portion having an inner edge defining a through-hole in the second terminal, the second terminal further including a fuse portion extending from the inner edge, the fuse portion comprising a fusible element terminating in a contact pad, wherein the substrate provides an electrically insulating barrier between the first terminal and the second terminal and wherein the via provides an electrical connection between the first terminal and the contact pad.Type: GrantFiled: November 10, 2019Date of Patent: November 24, 2020Assignee: Littelfuse, IncInventors: Maria Lily E. Rosios, Albert Enriquez, Todd Dietsch, Werner Johler
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Publication number: 20200075284Abstract: A disc fuse including an electrically insulating substrate having a via formed therethrough extending between a first surface and a second surface of the substrate, an electrically conductive first terminal disposed on the first surface of the substrate, and an electrically conductive second terminal disposed on the second surface of the substrate, the second terminal including an outer portion having an inner edge defining a through-hole in the second terminal, the second terminal further including a fuse portion extending from the inner edge, the fuse portion comprising a fusible element terminating in a contact pad, wherein the substrate provides an electrically insulating barrier between the first terminal and the second terminal and wherein the via provides an electrical connection between the first terminal and the contact pad.Type: ApplicationFiled: November 10, 2019Publication date: March 5, 2020Applicant: Littelfuse, Inc.Inventors: Maria Lily E. Rosios, Albert Enriquez, Todd Dietsch, Werner Johler
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Patent number: 10573480Abstract: A disc fuse including an electrically insulating substrate having a via formed therethrough extending between a first surface and a second surface of the substrate, an electrically conductive first terminal disposed on the first surface of the substrate, and an electrically conductive second terminal disposed on the second surface of the substrate, the second terminal including an outer portion having an inner edge defining a through-hole in the second terminal, the second terminal further including a fuse portion extending from the inner edge, the fuse portion comprising a fusible element terminating in a contact pad, wherein the substrate provides an electrically insulating barrier between the first terminal and the second terminal and wherein the via provides an electrical connection between the first terminal and the contact pad.Type: GrantFiled: June 21, 2018Date of Patent: February 25, 2020Assignee: LITTELFUSE, INC.Inventors: Maria Lily E. Rosios, Albert Enriquez, Todd Dietsch, Werner Johler
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Publication number: 20190393011Abstract: A disc fuse including an electrically insulating substrate having a via formed therethrough extending between a first surface and a second surface of the substrate, an electrically conductive first terminal disposed on the first surface of the substrate, and an electrically conductive second terminal disposed on the second surface of the substrate, the second terminal including an outer portion having an inner edge defining a through-hole in the second terminal, the second terminal further including a fuse portion extending from the inner edge, the fuse portion comprising a fusible element terminating in a contact pad, wherein the substrate provides an electrically insulating barrier between the first terminal and the second terminal and wherein the via provides an electrical connection between the first terminal and the contact pad.Type: ApplicationFiled: June 21, 2018Publication date: December 26, 2019Inventors: Maria Lily E. Rosios, Albert Enriquez, Todd Dietsch, Werner Johler
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Patent number: 10325739Abstract: A circuit protection device including a housing defining a chamber and a metal oxide varistor (MOV) stack disposed within the chamber. A first spring is electrically attached at a first end to a first input terminal of the MOV stack by a solder connection and at a second end to a first input line. The first spring is biased away from the first input terminal. A second spring is electrically attached to a second input terminal of the MOV stack by a solder connection and at a second end to a second input line. The second conductive spring is biased away from the second input terminal. When an overvoltage condition occurs, heat generated by the MOV stack melts at least one of the first or second solder connections to allow the corresponding springs to be displaced away from the respective MOV stack input terminals.Type: GrantFiled: January 10, 2018Date of Patent: June 18, 2019Assignee: LITTELFUSE, INC.Inventors: Wen Yang, Hailang Tang, Huawei Yin, Stephen J. Whitney, G. Todd Dietsch
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Patent number: 10062530Abstract: A circuit protection device including a housing (15) defining a chamber (19) and a metal oxide varistor (MOV) stack (310) disposed within the chamber (19). A first spring (330a) is electrically attached at a first end to a first input terminal (311a) of the MOV stack (310) by a solder connection (30) and at a second end to a first input line (20a). The first spring (330a) is biased away from the first input terminal (311a). A second spring (330b) is electrically attached to a second input terminal (311b) of the MOV stack (310) by a solder connection (40) and at a second end to a second input line (20b). The second conductive spring (330b) is biased away from the second input terminal (311b). When an overvoltage condition occurs, heat generated by the MOV stack (310) melts at least one of the first or second solder connections (30, 40) to allow the corresponding springs to be displaced away from the respective MOV stack (310) input terminals (311 a, 311 b), thereby creating an opening circuit.Type: GrantFiled: October 26, 2012Date of Patent: August 28, 2018Assignee: DONGGUAN LITTELFUSE ELECTRONICS CO., LTD.Inventors: Wen Yang, Hailang Tang, Huawei Yin, Stephen J. Whitney, G. Todd Dietsch
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Publication number: 20180130624Abstract: A circuit protection device including a housing defining a chamber and a metal oxide varistor (MOV) stack disposed within the chamber. A first spring is electrically attached at a first end to a first input terminal of the MOV stack by a solder connection and at a second end to a first input line. The first spring is biased away from the first input terminal. A second spring is electrically attached to a second input terminal of the MOV stack by a solder connection and at a second end to a second input line. The second conductive spring is biased away from the second input terminal. When an overvoltage condition occurs, heat generated by the MOV stack melts at least one of the first or second solder connections to allow the corresponding springs to be displaced away from the respective MOV stack input terminals, thereby creating an opening circuit.Type: ApplicationFiled: January 10, 2018Publication date: May 10, 2018Applicant: Littelfuse, Inc.Inventors: Wen Yang, Hailang Tang, Huawei Yin, Stephen J. Whitney, G. Todd Dietsch
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Patent number: 9460882Abstract: A compact, high breaking capacity fuse that includes a top insulative layer, at least one intermediate insulative layer, and a bottom insulative layer arranged in a vertically stacked configuration. The at least one intermediate layer may have a hole formed therethrough that defines an air gap within the fuse. A first conductive terminal may be formed on a first end of the fuse and a second conductive terminal may be formed on a second end of the fuse. At least one fusible element may connect the first terminal to the second terminal, thus providing an electrically conductive pathway therebetween. A portion of the at least one fusible element may pass through the air gap defined by the hole in the at least one intermediate insulative layer.Type: GrantFiled: March 14, 2013Date of Patent: October 4, 2016Assignee: Littelfuse, Inc.Inventors: Albert Enriquez, Demetrio Criste, Conrado DeLeon, Crispin Zulueta, Roel Retardo, John Semana, Gordon Todd Dietsch
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Patent number: 9401257Abstract: A circuit protection device includes a conductive layer which is connected to first and second terminals. A spring is electrically connected to the first and second terminals. When an over-voltage or over-temperature condition occurs within a charging circuit, one or more heat generating resistive elements melts material associated with one or more of the ends of the spring thereby releasing the spring to create an open circuit.Type: GrantFiled: August 26, 2013Date of Patent: July 26, 2016Assignee: LITTELFUSE, INC.Inventors: G. Todd Dietsch, Olga Spaldon-Stewart, Stephen Whitney
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Publication number: 20150228429Abstract: A circuit protection device including a housing (15) defining a chamber (19) and a metal oxide varistor (MOV) stack (310) disposed within the chamber (19). A first spring (330a) is electrically attached at a first end to a first input terminal (311a) of the MOV stack (310) by a solder connection (30) and at a second end to a first input line (20a). The first spring (330a) is biased away from the first input terminal (311a). A second spring (330b) is electrically attached to a second input terminal (311b) of the MOV stack (310) by a solder connection (40) and at a second end to a second input line (20b). The second conductive spring (330b) is biased away from the second input terminal (311b). When an overvoltage condition occurs, heat generated by the MOV stack (310) melts at least one of the first or second solder connections (30, 40) to allow the corresponding springs to be displaced away from the respective MOV stack (310) input terminals (311 a, 311 b), thereby creating an opening circuit.Type: ApplicationFiled: October 26, 2012Publication date: August 13, 2015Applicant: LITTELFUSE, INC.Inventors: Wen Yang, Hailang Tang, Huawei Yin, Stephen J. Whitney, G. Todd Dietsch
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Publication number: 20150102896Abstract: A fuse including a fuse element, a diffusion layer, and a barrier layer is provided. The barrier layer acts to slow down and/or prevent premature diffusion of the diffusion material into the fuse element during normal operation. As a result, the fuse may be operated in environments having higher ambient temperatures and/or higher currents than otherwise possible. some examples provide a fuse including a fuse element formed from a first conductive material, the fuse element, a barrier layer disposed on a surface of the fuse element, the barrier layer including first and second portions separated by a gap, the barrier layer formed from a second conductive material different from the first conductive material, and a diffusion layer disposed in the gap on the surface of the fuse element, the diffusion layer formed from a third conductive material different from the second conductive material and first conductive material.Type: ApplicationFiled: October 11, 2013Publication date: April 16, 2015Applicant: LITTELFUSE, INC.Inventors: GORDON TODD DIETSCH, FRANCISCO URIBE, FREDERICK DELOS REYES, JOHN J. MONKOWSKI, JR.
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Publication number: 20150009007Abstract: A compact, high breaking capacity fuse that includes a top insulative layer, at least one intermediate insulative layer, and a bottom insulative layer arranged in a vertically stacked configuration. The at least one intermediate layer may have a hole formed therethrough that defines a chamber having arc suppression material disposed therein. A first conductive terminal may be formed on a first end of the fuse and a second conductive terminal may be formed on a second end of the fuse. At least one fusible element may connect the first terminal to the second terminal, thus providing an electrically conductive pathway therebetween. A portion of the at least one fusible element may pass through the air gap defined by the hole in the at least one intermediate insulative layer.Type: ApplicationFiled: September 23, 2014Publication date: January 8, 2015Applicant: LITTELFUSE, INC.Inventors: ALBERT ENRIQUEZ, DEMETRIO CRISTE, CONRADO DE LEON, CRISPIN ZULUETA, ROEL RETARDO, JOHN SEMANA, Gordon Todd Dietsch
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Publication number: 20140368309Abstract: A circuit protection device, including a conductor connected to first and second terminals and a spring exerting force on the conductor to move the conductor away from the first and/or second terminals when an over-voltage or over-temperature condition occurs within a charging circuit. One or more heat generating resistive elements melts material associated with one or more connection points of the conductor thereby releasing the conductor such that the spring moves the conductor to create an open circuit.Type: ApplicationFiled: June 18, 2013Publication date: December 18, 2014Applicant: LITTELFUSE, INC.Inventors: G. Todd Dietsch, Olga Spaldon-Stewart, Stephen J. Whitney