Patents by Inventor Todd Eckhardt

Todd Eckhardt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9658126
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor unit subassembly for installation in or use with a pressure sensor housing may include at least one pressure sensor signal output terminal supported by a printed circuit board, a pressure input port, and a pressure sense element secured relative to one or more printed circuit boards. The printed circuit board(s) may include circuitry configured to format pressure output signals provided by the pressure sense element into a particularly chosen output format, and may provide the formatted pressure output signal(s) to an attached electrical connector of the pressure sensor housing. In some cases, the sensor unit subassemblies can be mixed with a multitude of different electrical connectors and/or with a multitude of different port connections to from a wide array of pressure sensor assemblies.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: May 23, 2017
    Assignee: Honeywell International Inc.
    Inventors: Ryan Jones, Todd Eckhardt, Richard Wade
  • Patent number: 8934263
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: January 13, 2015
    Assignee: Honeywell International Inc.
    Inventors: Todd Eckhardt, Jim Machir, Palani Thanigachalam, Sunil Job
  • Patent number: 8817483
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a connector assembly for a sensor assembly may include an electrical connector, a printed circuit board and a conductive outer housing. The electrical connector may include a mechanical connector and electrical terminals exposed at a first end and at a second end of the mechanical connector. The electrical connector, printed circuit board and conductive outer housing may all be electrically connected to one another. In some instances, a plurality of electrical connectors having different mechanically shaped second ends and similarly shaped first ends may be provided, from which one electrical connector may be chosen for use in the connector assembly.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: August 26, 2014
    Assignee: Honeywell International Inc.
    Inventors: Todd Eckhardt, Paul Rozgo, Ian Bentley, Jim Machir, Ryan Jones
  • Patent number: 8806964
    Abstract: A force sensor may include a sense die mounted to a substrate and an actuating assembly for transmitting an external force to the sense die. The sense die may include a diaphragm, a boss extending from the diaphragm, and one or more sensing elements (e.g., piezoresistive elements positioned on the diaphragm). The actuation assembly may include a force receiving feature configured to receive an external force at a first end and transfer at least a portion of the received external force through a second end to the diaphragm via intimate contact with a bottom side of the boss. In some cases, the force sensor may also include signal conditioning circuitry.
    Type: Grant
    Filed: March 23, 2012
    Date of Patent: August 19, 2014
    Assignee: Honeywell International Inc.
    Inventors: Palani Thanigachalam, Todd Eckhardt, Richard Wade
  • Publication number: 20140144244
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor unit subassembly for installation in or use with a pressure sensor housing may include at least one pressure sensor signal output terminal supported by a printed circuit board, a pressure input port, and a pressure sense element secured relative to one or more printed circuit boards. The printed circuit board(s) may include circuitry configured to format pressure output signals provided by the pressure sense element into a particularly chosen output format, and may provide the formatted pressure output signal(s) to an attached electrical connector of the pressure sensor housing. In some cases, the sensor unit subassemblies can be mixed with a multitude of different electrical connectors and/or with a multitude of different port connections to from a wide array of pressure sensor assemblies.
    Type: Application
    Filed: February 3, 2014
    Publication date: May 29, 2014
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Ryan Jones, Todd Eckhardt, Richard Wade
  • Patent number: 8671753
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cable harness assembly for connection with a sensor assembly may include a cable cover having a first end and a second end, a cable extending through an opening in the first end of the of the cable cover, and a crimp ring configured to engage the cable at a position within the cable cover, such that the attached crimp ring may not fit through the opening. The second end of the cable cover may be configured to connect to a housing of an electrical connector. Further, the cable may have wires that may be configured to electrically connect to electrical terminals of the electrical connector. In some instances, the electrical connector may be electrically connected to a sensor.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: March 18, 2014
    Assignee: Honeywell International Inc.
    Inventors: Todd Eckhardt, Pavan R. Kashyap, Jim Machir, Palani Thanigachalam
  • Patent number: 8656786
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor unit subassembly for installation in or use with a pressure sensor housing may include at least one pressure sensor signal output terminal supported by a printed circuit board, a pressure input port, and a pressure sense element secured relative to one or more printed circuit boards. The printed circuit board(s) may include circuitry configured to format pressure output signals provided by the pressure sense element into a particularly chosen output format, and may provide the formatted pressure output signal(s) to an attached electrical connector of the pressure sensor housing. In some cases, the sensor unit subassemblies can be mixed with a multitude of different electrical connectors and/or with a multitude of different port connections to from a wide array of pressure sensor assemblies.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: February 25, 2014
    Assignee: Honeywell International Inc.
    Inventors: Ryan Jones, Todd Eckhardt, Jim Machir, Richard Wade
  • Publication number: 20130247689
    Abstract: A force sensor may include a sense die mounted to a substrate and an actuating assembly for transmitting an external force to the sense die. The sense die may include a diaphragm, a boss extending from the diaphragm, and one or more sensing elements (e.g., piezoresistive elements positioned on the diaphragm). The actuation assembly may include a force receiving feature configured to receive an external force at a first end and transfer at least a portion of the received external force through a second end to the diaphragm via intimate contact with a bottom side of the boss. In some cases, the force sensor may also include signal conditioning circuitry.
    Type: Application
    Filed: March 23, 2012
    Publication date: September 26, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Palani Thanigachalam, Todd Eckhardt, Richard Wade
  • Patent number: 8534130
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some illustrative cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In one example, the sensor unit may include a carrier carrying a sense element, where the carrier may extend into a recess of the pressure port and may be secured to the pressure port at an internal side thereof through the use of an adhesive layer.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: September 17, 2013
    Assignee: Honeywell International Inc.
    Inventors: Todd Eckhardt, Alistair David Bradley, Sunil Job, Palani Thanigachalam, Jim Machir
  • Patent number: 8459125
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In some instances, the sensor unit may include pressure signal output terminals electrically connected to electrical terminals of the electrical connector.
    Type: Grant
    Filed: August 1, 2011
    Date of Patent: June 11, 2013
    Assignee: Honeywell International Inc.
    Inventors: Richard A. Wade, Ryan Jones, Todd Eckhardt, James A. Machir, Ian Bentley
  • Publication number: 20130033830
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a connector assembly for a sensor assembly may include an electrical connector, a printed circuit board and a conductive outer housing. The electrical connector may include a mechanical connector and electrical terminals exposed at a first end and at a second end of the mechanical connector. The electrical connector, printed circuit board and conductive outer housing may all be electrically connected to one another. In some instances, a plurality of electrical connectors having different mechanically shaped second ends and similarly shaped first ends may be provided, from which one electrical connector may be chosen for use in the connector assembly.
    Type: Application
    Filed: August 1, 2011
    Publication date: February 7, 2013
    Inventors: Todd Eckhardt, Paul Rozgo, Ian Bentley, Jim Machir, Ryan Jones
  • Publication number: 20130031976
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cable harness assembly for connection with a sensor assembly may include a cable cover having a first end and a second end, a cable extending through an opening in the first end of the of the cable cover, and a crimp ring configured to engage the cable at a position within the cable cover, such that the attached crimp ring may not fit through the opening. The second end of the cable cover may be configured to connect to a housing of an electrical connector. Further, the cable may have wires that may be configured to electrically connect to electrical terminals of the electrical connector. In some instances, the electrical connector may be electrically connected to a sensor.
    Type: Application
    Filed: August 1, 2011
    Publication date: February 7, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Todd Eckhardt, Pavan R. Kashyap, Jim Machir, Palani Thanigachalam
  • Publication number: 20130031986
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some illustrative cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In one example, the sensor unit may include a carrier carrying a sense element, where the carrier may extend into a recess of the pressure port and may be secured to the pressure port at an internal side thereof through the use of an adhesive layer.
    Type: Application
    Filed: August 1, 2011
    Publication date: February 7, 2013
    Inventors: Todd Eckhardt, Alistair David Bradley, Sunil Job, Palani Thanigachalam, Jim Machir
  • Publication number: 20130031984
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor unit subassembly for installation in or use with a pressure sensor housing may include at least one pressure sensor signal output terminal supported by a printed circuit board, a pressure input port, and a pressure sense element secured relative to one or more printed circuit boards. The printed circuit board(s) may include circuitry configured to format pressure output signals provided by the pressure sense element into a particularly chosen output format, and may provide the formatted pressure output signal(s) to an attached electrical connector of the pressure sensor housing. In some cases, the sensor unit subassemblies can be mixed with a multitude of different electrical connectors and/or with a multitude of different port connections to from a wide array of pressure sensor assemblies.
    Type: Application
    Filed: August 1, 2011
    Publication date: February 7, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Ryan Jones, Todd Eckhardt, Jim Machir, Richard Wade
  • Publication number: 20130033841
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.
    Type: Application
    Filed: August 1, 2011
    Publication date: February 7, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Todd Eckhardt, Jim Machir, Palani Thanigachalam, Sunil Job
  • Publication number: 20130031985
    Abstract: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a sensor assembly may include a pressure port connected to a sensor unit, an electrical connector connected to the sensor unit and an outer housing encompassing at least portions of the pressure port, sensor unit and electrical connector. In some instances, the sensor unit may include pressure signal output terminals electrically connected to electrical terminals of the electrical connector.
    Type: Application
    Filed: August 1, 2011
    Publication date: February 7, 2013
    Applicant: HONEYWELL INTERNATIONAL INC.
    Inventors: Richard Wade, Ryan Jones, Todd Eckhardt, Jim Machir, Ian Bentley
  • Patent number: 8327715
    Abstract: A force sensor apparatus and method of forming the same. The apparatus includes a force sense element that can be attached to a substrate. An actuator disposed in a hole formed within the cap is operably coupled to the force sense element for transferring force to the sense element in response to receiving a force from an external source. The force sense element is configured to sense the external force and generate an output signal representing the force. Preferably, one or more bond pads, associated with the force sense element and the substrate, can be electrically connected via wire bonding. A cover associated with an integrated flexible membrane can be mounted on the substrate in order to protect internal components associated with the force sensor apparatus from an external environment.
    Type: Grant
    Filed: July 2, 2009
    Date of Patent: December 11, 2012
    Assignee: Honeywell International Inc.
    Inventors: Alistair David Bradley, Todd Eckhardt, Ryan Jones, Richard Wade
  • Patent number: 8091436
    Abstract: A differential force sensor method and apparatus for automatically monitoring manual injections through an intravenous line. The differential force sensor includes two piezoresistive sense die that are packaged in close proximity utilizing a number of packaging processes. The two piezoresistive sense die can be utilized to measure forces exerted on a diaphragm on either side of an orifice. The piezoresistive sense die can be packaged in close proximity to make intimate contact with the diaphragms on either side of the orifice. The differential force sensor further includes two plungers that make intimate contact with the diaphragm and transfer the force into the piezo-resistive sense dies. Additionally, one or more ASICs and microcontrollers can be utilized to provide thermal calibration and differential calculation.
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: January 10, 2012
    Assignee: Honeywell International Inc.
    Inventors: Todd Eckhardt, Richard Wade, Ryan Jones
  • Patent number: 7930944
    Abstract: An ASIC compensated pressure sensor includes a sense die, an ASIC chip, and supporting elements. The sense die includes a metallized surface for attaching the sense die to a mounting surface. The resulting solder joint provides a hermetic seal that is resistant to a wide range of media associated with different environmental conditions. The mounting surface can contain the ASIC and electronics for compensation or can be attached to another mounting surface, which contains the ASIC and electronics. Either configuration can include collars of different styles for ease of assembly and in turn can be attached to a mating connector. The mounting surface can possess a closely matched coefficient of thermal expansion to the sense die in order to enhance electrical stability of the output signal over a wide temperature and pressure ranges.
    Type: Grant
    Filed: May 14, 2008
    Date of Patent: April 26, 2011
    Assignee: Honeywell International Inc.
    Inventors: Jim Machir, Todd Eckhardt, Paul Rozgo, William S. Hoover
  • Patent number: 7908926
    Abstract: An apparatus and method of pressure sensing. The system can include a sensing apparatus connectable with a supply conduit and a mounting plate. The apparatus can include a coupling device for receiving the supply conduit, a housing having first and second openings in fluid communication with each other where the first opening receives at least a portion of the coupling device, and a sensing device having an insertion portion and a sensing area. The insertion portion can be received in the second opening of the housing. A first connection between the housing and the mounting plate can be remote from the sensing area, and a second connection between the housing and the sensing device can be remote from the sensing area.
    Type: Grant
    Filed: November 9, 2007
    Date of Patent: March 22, 2011
    Assignee: Honeywell International Inc.
    Inventor: Todd Eckhardt