Abstract: A wire conveyance system is provided for a wire bonding machine having, in series, a first wire handler, a wire slacking device and a second wire handler. The wire slacking device includes a wire support chamber having a substantially enclosed bottom, opposing first and second vertical sidewalls, a substantially open top, a back opening and a front opening. The wire slacking device further includes a pressurized fluid source and first and second fluid orifices for receiving a pressurized fluid from the pressurized fluid source. The fluid orifices extend through the first or second sidewall of the wire support chamber with the second fluid orifice being positioned downstream of the first fluid orifice. First and second fluid paths are provided in fluid communication with the pressurized fluid source via the first and second fluid orifices. The first and second fluid paths extend upward between the first and second sidewalls of the wire support chamber and out the open top.

Abstract: A single multifunction fixture secures an electronic device in a predetermined position and provides guide slots for the worker to place the individual conductors of a multiconductor cable in place such that each conductor aligns with a corresponding contact on the device when both the cable and the device are secured in the fixture. The fixture includes a movable head that can be brought into contact with the conductors once they are positioned over the corresponding electrical contacts to form electrically conductive paths through the head, electrical conductor, device contact and fixture for each of the cable conductors. The electrically conductive paths through the fixture form high current carrying capacity paths which, when sufficient current is passed therethrough, function to weld the cable conductors to their corresponding electrical contact on the device.