Patents by Inventor Todd H. Buley

Todd H. Buley has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components
    Patent number: 6974071
    Abstract: An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with respect to the direction and an opening on a bottom thereof for access of a protruding connector disposed near an end of the substrate to the molten solder wave. The angle of incline is sufficient to prevent a component disposed at a distance from the end of the substrate from contacting the molten solder wave when the substrate holder is moved over the solder wave device. A shield in the substrate holder prevents the component not to be soldered from contacting the molten solder wave.
    Type: Grant
    Filed: September 18, 2003
    Date of Patent: December 13, 2005
    Assignee: International Business Machines Corporation
    Inventors: Todd H. Buley, Brian Chapman, Roger Lam, Wai Mon Ma, John P. Weir
  • Method of assembling a land grid array module
    Patent number: 6711810
    Abstract: A method in which an alignment tool consisting of a nest and guide tool is used to align an LGA module in the nest and then the LGA module is removed from the nest and aligned with a circuit card by the use of the guide tool.
    Type: Grant
    Filed: September 19, 2001
    Date of Patent: March 30, 2004
    Assignee: International Business Machines Corporation
    Inventors: Todd H. Buley, Roger Lam, Daniel O'Connor, Charles Hampton Perry
  • Method of assembling a land grid array module and alignment tool for use therewith
    Publication number: 20030051338
    Abstract: A method in which an alignment tool consisting of a nest and guide tool is used to align an LGA module in the nest and then the LGA module is removed from the nest and aligned with a circuit card by the use of the guide tool.
    Type: Application
    Filed: September 19, 2001
    Publication date: March 20, 2003
    Applicant: International Business Machines Corporation
    Inventors: Todd H. Buley, Roger Lam, Daniel O'Connor, Charles Hampton Perry