Patents by Inventor Todd H. Herder

Todd H. Herder has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Compliant electrically connective bumps for an adhesive flip chip integrated circuit device and methods for forming same
    Patent number: 5508228
    Abstract: Compliant electrically connection bumps for an adhesive flip chip integrated circuit device and various methods for forming the bumps include the steps of forming polymer bumps on a substrate or an integrated circuit die and coating the polymer bumps with a metallization layer. The polymer bump forming step includes the steps of coating a polymer material on a substrate, curing the polymer and the etching the bump pattern from the polymer material. The overcoating step includes electrolessly plating a ductile metal such as gold on the polymer bump.
    Type: Grant
    Filed: February 14, 1994
    Date of Patent: April 16, 1996
    Assignee: Microelectronics and Computer Technology Corporation
    Inventors: Ernest R. Nolan, Diana C. Duane, Todd H. Herder, Thomas A. Bishop, Kimcuc T. Tran, Robert W. Froehlich, Randy L. German, Richard D. Nelson, Chung J. Lee, Mark R. Breen, Kathryn V. Keswick