Abstract: An implantable medical device includes a housing forming an internal cavity, the housing defining a profile with a height and a width and further defining a thickness perpendicular to its profile. The thickness of the housing is shorter than both the height and the width of the profile of the housing. The implantable medical device further includes at least one battery within the internal cavity, at least one capacitor adjacent the battery within the internal cavity, the capacitor and the battery being located along a common plane within the internal cavity, and circuitry within the internal cavity. The circuitry extends over both the battery and the capacitor within the internal cavity such that the circuitry is in a stacked arrangement relative to the battery and the capacitor.

Abstract: An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.

Abstract: An implantable medical device includes a housing forming an internal cavity, the housing defining a profile with a height and a width and further defining a thickness perpendicular to its profile. The thickness of the housing is shorter than both the height and the width of the profile of the housing. The implantable medical device further includes at least one battery within the internal cavity, at least one capacitor adjacent the battery within the internal cavity, the capacitor and the battery being located along a common plane within the internal cavity, and circuitry within the internal cavity. The circuitry extends over both the battery and the capacitor within the internal cavity such that the circuitry is in a stacked arrangement relative to the battery and the capacitor.

Abstract: An implantable medical device (IMD) having a hermetic housing formed from a case and a cover each having an exterior surface and an interior surface. An IMD component is mounted to the interior surface of the cover and has an electrical contact. A hybrid circuit is assembled in the case. The IMD component electrical contact is electrically coupled to the to the hybrid circuit assembled in the case.

Abstract: An RF antenna flexible circuit interconnect is disclosed with unique micro connectors. The RF antenna flexible circuit interconnect further includes a planer flexible body having an embedded RF transmission line with a first end and a second end. A first antenna micro connector is electrically coupled to the first end of the RF transmission line and a second antenna micro connector is electrically coupled to the second end of the RF transmission line. Each of the first and second antenna micro connectors include an antenna micro connector housing and an antenna central contact socket securely positioned within the antenna micro connector housing. The antenna central contact socket may also include inward bending fingers and may be designed to engage a pin that is inserted into the central contact socket.

Abstract: A laser ribbon bond pad array connector is disclosed for electrically connecting a RF module to an IMD circuit board in an implantable medical device. The array connector includes a connector body with a plurality of electrically isolated bonding fingers embedded in the connector body. Each bonding finger includes a solder pad that is on a first surface of the connector body and a laser ribbon bond pad that is on a second surface of the connector body. The first and second surfaces are spaced apart in angular relations thereof.