Abstract: Memory modules and sockets are disclosed. An example memory module comprises a circuit board, a first row of connection pins disposed along an edge of the circuit board, and a second row of pins disposed adjacent to the first row of pins and further from the edge than the first row of pins.

Abstract: Techniques for storing and accessing metadata within selective dynamic random access memory (DRAM) devices are described. In one example, a dual in-line memory module (DIMM) includes a plurality of dynamic random access memory (DRAM) devices, wherein each of plurality of DRAM devices includes on-die ECC bits. At least one of the plurality of DRAM devices includes circuitry to provide access to read from and write to the on-die ECC bits of the DRAM device. The DIMM includes one or more pins to transmit metadata to and from the on-die ECC bits of the DRAM device.

Abstract: Methods and apparatus for Cross DRAM DIMM sub-channel pairing. Memory channels on a memory controller or System on a Chip (SoC) are segmented into two subchannels, each including Command and Address (C/A) signals, DQ (data) lines. Under different solutions the two subchannels may share a command-bus clock or use separate command-bus clocks. Some approaches use subchannels from different memory channels to provide the C/A and DQ lines for two subchannels to a given DIMM. One solution implements an additional command-bus clock on the DIMM connector repurposing existing MCR pins to provide command-bus clock signals to a Registered Clock Driver (RCD) to allow the subchannels to be fully independent. Another solution is the pair every other DRAM controller to the same command-bus clock. Other solutions employ Skip-1, Skip-2, and Skip-3 configurations under which the clocks for the DDR-IO circuitry are not logically co-located with the subchannel IO circuitry.

Abstract: An electronic device for transmitting data is described herein. In some examples, the electronic device includes a package substrate, and a plurality of integrated circuits to be coupled to the package substrate, at least one integrated circuit comprising a topside connector or an edge connector to be coupled to a cable that is to couple to a cable receptacle.

Abstract: An electronic device for transmitting data is described herein. In some examples, the electronic device includes a package substrate, and a plurality of integrated circuits to be coupled to the package substrate, at least one integrated circuit comprising a topside connector or an edge connector to be coupled to a cable that is to couple to a cable receptacle.

Abstract: In one embodiment, the present invention includes a system having an electromagnetic coupler probe to electromagnetically sample signals from a device under test or a link under test and a receiver, e.g., configured as an integrated circuit that is to receive the sampled electromagnetic signals from the probe and output digital signals corresponding thereto. Other embodiments are described and claimed.

Abstract: In one embodiment, the present invention includes a system having an electromagnetic coupler probe to electromagnetically sample signals from a device under test or a link under test and a receiver, e.g., configured as an integrated circuit that is to receive the sampled electromagnetic signals from the probe and output digital signals corresponding thereto. Other embodiments are described and claimed.

Abstract: In at least one embodiment an apparatus is provided that includes an electromagnetic coupler to provide sampled electromagnetic signals and an electronics component to receive the sampled electromagnetic signals from the electromagnetic coupler, to amplify and recover a derivative-like output signal, and to provide recovered sampled electromagnetic signals to an oscilloscope with a unity transfer function. Other embodiments may be described and claimed.

Abstract: In at least one embodiment an apparatus is provided that includes an electromagnetic coupler probe to provide sampled electromagnetic signals and an electronics component to receive the sampled electromagnetic signals from the electromagnetic coupler probe and to provide recovered sampled electromagnetic signals. Other embodiments may be described and claimed.

Abstract: In at least one embodiment an apparatus is provided that includes an electromagnetic coupler probe to provide sampled electromagnetic signals and an electronics component to receive the sampled electromagnetic signals from the electromagnetic coupler probe and to provide recovered sampled electromagnetic signals. Other embodiments may be described and claimed.

Abstract: A tunable current mode integrator for low-frequency continuous-time filters that requires a reduced amount of area when implemented in an integrated circuit (IC). The integrator includes input and output transistors, and cross-coupled current mirrors, integration capacitors, and operational transconductance amplifiers (OTAs) that form a feedback structure with the input transistors. Input currents are converted to small current swings within the OTAs, and are subsequently integrated by the capacitors. Resulting integrated voltages are converted to output currents by the output transistors.