Patents by Inventor Todd Husom
Todd Husom has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 7668430Abstract: Telecommunications chassis and associated modules for use with the telecommunications chassis are disclosed. Embodiments of the telecommunications chassis include structures such as horizontal channels and/or horizontal surfaces with ridges and/or slots in one surface and slots in ridges of another for receiving edges of modules that mount within the chassis. Other structures of embodiments include divider slots in the horizontal surfaces that receive edges of divider walls to fix the divider walls in place, heat baffle surfaces included within the chassis, and/or cable guides with radius limiters. Module embodiments include structures such as faceplates with angled portions with fiber optic cable connections directed toward the fiber cable's direction of travel. Other module structures include shells that enclose the circuit board and/or provide angled portions with fiber optic cable connections.Type: GrantFiled: November 29, 2004Date of Patent: February 23, 2010Assignee: ADC Telecommunications, Inc.Inventors: Brian J. McClellan, Dale C. Madsen, Robin L. Berg, Jr., Joseph S. Czyscon, Steven W. Skradde, Derek G. Sayres, Todd Husom
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Patent number: 7639510Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.Type: GrantFiled: January 14, 2008Date of Patent: December 29, 2009Assignee: ADC Telecommunications, Inc.Inventors: Gregory J. Fritz, Alejandra Anderson, Robin Berg, Todd Husom, Eric Sit
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Publication number: 20080204995Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.Type: ApplicationFiled: January 14, 2008Publication date: August 28, 2008Applicant: ADC TELECOMMUNICATIONS INC.Inventors: Gregory J. Fritz, Alejandra Anderson, Robin Berg, Todd Husom, Eric Sit
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Patent number: 7324348Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.Type: GrantFiled: June 28, 2005Date of Patent: January 29, 2008Assignee: ADC Telecommunications, Inc.Inventors: Robin Berg, Jr., Todd Husom, Derek Sayres
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Publication number: 20060002098Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.Type: ApplicationFiled: June 28, 2005Publication date: January 5, 2006Applicant: ADC Telecommunications, Inc.Inventors: Robin Berg, Todd Husom, Derek Sayres
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Patent number: 6940730Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.Type: GrantFiled: August 7, 2003Date of Patent: September 6, 2005Assignee: ADC Telecommunications, Inc.Inventors: Robin Berg, Jr., Todd Husom, Derek Sayres
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Publication number: 20050135770Abstract: Telecommunications chassis and associated modules for use with the telecommunications chassis are disclosed. Embodiments of the telecommunications chassis include structures such as horizontal channels and/or horizontal surfaces with ridges and/or slots in one surface and slots in ridges of another for receiving edges of modules that mount within the chassis. Other structures of embodiments include divider slots in the horizontal surfaces that receive edges of divider walls to fix the divider walls in place, heat baffle surfaces included within the chassis, and/or cable guides with radius limiters. Module embodiments include structures such as faceplates with angled portions with fiber optic cable connections directed toward the fiber cable's direction of travel. Other module structures include shells that enclose the circuit board and/or provide angled portions with fiber optic cable connections.Type: ApplicationFiled: November 29, 2004Publication date: June 23, 2005Applicant: ADC Telecommunications, Inc.Inventors: Brian McClellan, Dale Madsen, Robin Berg, Joseph Czyscon, Steven Skradde, Derek Sayres, Todd Husom
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Patent number: 6824312Abstract: Telecommunications chassis and associated modules for use with the telecommunications chassis are disclosed. Embodiments of the telecommunications chassis include structures such as horizontal channels and/or horizontal surfaces with ridges and/or slots in one surface and slots in ridges of another for receiving edges of modules that mount within the chassis. Other structures of embodiments include divider slots in the horizontal surfaces that receive edges of divider walls to fix the divider walls in place, heat baffle surfaces included within the chassis, and/or cable guides with radius limiters. Module embodiments include structures such as faceplates with angled portions with fiber optic cable connections directed toward the fiber cable's direction of travel. Other module structures include shells that enclose the circuit board and/or provide angled portions with fiber optic cable connections.Type: GrantFiled: June 4, 2001Date of Patent: November 30, 2004Assignee: ADC Telecommunications, Inc.Inventors: Brian J. McClellan, Dale C. Madsen, Robin L. Berg, Jr., Joseph S. Czyscon, Steven W. Skradde, Derek G. Sayres, Todd Husom
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Patent number: 6707686Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.Type: GrantFiled: May 18, 2001Date of Patent: March 16, 2004Assignee: ADC Telecommunications, Inc.Inventors: Gregory J. Fritz, Alejandra Anderson, Robin Berg, Todd Husom, Eric Sit
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Patent number: 6637845Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The guide includes an opening that at least partially aligns with slots on the adjacent surface of the inner housing. The circuit card includes a finger extending from a faceplate that facilitates insertion and removal of the circuit card relative to the chassis.Type: GrantFiled: February 28, 2001Date of Patent: October 28, 2003Assignee: ADC Telecommunications, Inc.Inventors: Robin Berg, Jr., Todd Husom, Derek Sayres
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Patent number: 6590782Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.Type: GrantFiled: April 3, 2001Date of Patent: July 8, 2003Assignee: ADC Telecommunications, Inc.Inventors: Gregory J. Fritz, Alejandra Anderson, Robin Berg, Todd Husom, Eric Sit
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Publication number: 20020181896Abstract: Telecommunications chassis and associated modules for use with the telecommunications chassis are disclosed. Embodiments of the telecommunications chassis include structures such as horizontal channels and/or horizontal surfaces with ridges and/or slots in one surface and slots in ridges of another for receiving edges of modules that mount within the chassis. Other structures of embodiments include divider slots in the horizontal surfaces that receive edges of divider walls to fix the divider walls in place, heat baffle surfaces included within the chassis, and/or cable guides with radius limiters. Module embodiments include structures such as faceplates with angled portions with fiber optic cable connections directed toward the fiber cable's direction of travel. Other module structures include shells that enclose the circuit board and/or provide angled portions with fiber optic cable connections.Type: ApplicationFiled: June 4, 2001Publication date: December 5, 2002Inventors: Brian J. McClellan, Dale C. Madsen, Robin L. Berg, Joseph S. Czyscon, Steven W. Skradde, Derek G. Sayres, Todd Husom
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Publication number: 20020118524Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The guide includes an opening that at least partially aligns with slots on the adjacent surface of the inner housing. The circuit card includes a finger extending from a faceplate that facilitates insertion and removal of the circuit card relative to the chassis.Type: ApplicationFiled: February 28, 2001Publication date: August 29, 2002Inventors: Robin Berg, Todd Husom, Derek Sayres
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Publication number: 20020118525Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.Type: ApplicationFiled: April 3, 2001Publication date: August 29, 2002Inventors: Gregory J. Fritz, Alejandra Anderson, Robin Berg, Todd Husom, Eric Sit
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Publication number: 20020118526Abstract: A chassis and associated telecommunication circuit card are disclosed. The chassis has heat dissipation and flame containment features while accommodating a high density of the circuitry cards. Embodiments include an inner housing with a double-layer middle floor dividing the chassis into top and bottom chambers. Each layer has partially aligned slots, and an air gap is provided between the two layers. Embodiments also include a double-layer mesh cover with an air gap existing between the two mesh layers. Projections and grooves are provided on the inner surfaces of the inner housing to receive circuit cards having a guide on one edge and a fin on another. The circuit card includes conductor structures such as multiple board layers with paired and segregated conductors. The circuit card also includes some components positioned to cooperate with the ventilation features of the chassis and includes some components chosen for low-power consumption or reduced flammability.Type: ApplicationFiled: May 18, 2001Publication date: August 29, 2002Inventors: Gregory J. Fritz, Alejandra Anderson, Robin Berg, Todd Husom, Eric Sit
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Patent number: D395439Type: GrantFiled: October 7, 1996Date of Patent: June 23, 1998Assignee: Graco Inc.Inventors: Mark A. King, Todd Husom, Joseph E. LaBossierre