Patents by Inventor Todd Johnson, II

Todd Johnson, II has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Composition for stripping solder and tin from printed circuit boards
    Patent number: 6258294
    Abstract: A composition and method for stripping tin and solder and the underlying tin-copper alloy from the copper substrate of a printed circuit board is presented. The liquid includes an aqueous solution of nitric acid in an amount sufficient to dissolve solder and tin, a source of ferric ions in an amount sufficient to dissolve the tin-copper alloy, and a source of halide ions in an amount sufficient to significantly improve the resistance between printed circuits.
    Type: Grant
    Filed: October 1, 1997
    Date of Patent: July 10, 2001
    Assignee: Morton International, Inc.
    Inventors: Todd Johnson, II, John T. Fakler