Abstract: The present invention provides a hot melt conductor paste composition that includes conductive particles and glass particles dispersed in a thermoplastic polymer system. The hot melt conductor paste composition according to the invention is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C. to form a flowable liquid that can be applied to a silicon substrate by screen printing. The hot melt conductor paste composition is particularly suitable for use in the fabrication of photovoltaic cells.

Abstract: The present invention provides a hot melt conductor paste composition that includes conductive particles and glass particles dispersed in a thermoplastic polymer system. The hot melt conductor paste composition according to the invention is a solid at room temperature, but melts at a temperature of from about 35° C. to about 90° C. to form a flowable liquid that can be applied to a silicon substrate by screen printing. The hot melt conductor paste composition is particularly suitable for use in the fabrication of photovoltaic cells.

Abstract: The present invention provides a unique method of making a barrier rib structure for a plasma display panel. Instead of employing the traditional screen printing method of making barrier ribs, the present invention employs a section of low temperature cofired ceramic dielectric. The unique method includes the steps of providing a fusible dielectric composition in an organic binder, applying the composition on a glass sheet, applying a photoresist composition, placing a mask over the coated plate to provide a pattern of openings in the photoresist corresponding to the pattern of the picture subcells, using a laser to remove the portions of the coating not covered by the photoresist to form the color subcells and heating the resulting assembly to a sintering temperature to fuse the dielectric composition to form the barrier rib structure and to fuse the barrier rib structure to the glass plate.

Abstract: The present invention provides a thermally conductive material which can be used as a heat sink in a multi-chip module or multilayer circuit structure. The material is formed by firing a composition including a solids portion comprising from about 1% to about 30% by weight glass and from about 70% to about 98% by weight silver. The glass comprises in weight percent from about 5% to about 60% B.sub.2 O.sub.3, from about 30% to about 90% SiO.sub.2, up to 10% Li.sub.2 O, up to 10% Na.sub.2 O, up to 10% K.sub.2 O and up to 10% Al.sub.2 O.sub.3. The material may be formed using a second glass selected from the group comprising of (i) a glass comprising in weight percent from about 10% to about 60% CaO, from about 5% to about 55% B.sub.2 O.sub.3 and from about 5% to about 55% SiO.sub.2 ; and (ii) a glass comprising in weight percent from about 35% to about 70% SiO.sub.2, from about 20% to about 45% Al.sub.2 O.sub.3, from about 0% to about 8% BaO and from about 5% to about 30% MgO.