Abstract: A method of applying a dielectric coating on a structure array of a component of an electrical device includes applying a first layer of a first dielectric material on a structure array with an atomic layer deposition (ALD) process or a spin-on cladding process. The structure array has a plurality of features. The method may include applying a second layer of a second dielectric material on the first layer with an evaporation deposition process, a physical vapor deposition process (PVD), or a flux-controlled chemical vapor deposition (CVD) process. The first layer has a first thickness and the second layer has a second thickness that is greater than the first thickness.

Abstract: A method of applying a dielectric coating on a structure array of a component of an electrical device includes applying a first layer of a first dielectric material on a structure array with an atomic layer deposition (ALD) process. The structure array is formed on a substrate and has a plurality of features, each of the plurality of features having an aspect ratio of at least 1:1.

Abstract: A system may include a magnetic sensor including a free magnetic layer and a fixed magnetic layer; a sample container disposed over the magnetic stack; a plurality of capture DNA oligomers on a surface of the magnetic biosensor within the volume defined by the sample container above the magnetic stack, wherein each of the plurality of capture DNA oligomers includes at least one thymine base configured to bind to an Hg2+ ion; a magnetic field generator configured to generate a magnetic field that influences the free layer; and circuitry configured to measure a resistance of the magnetic sensor.