Abstract: A system to imprint patterns on impressionable materials by generating a pressure differential within an imprinting chamber by creating a substantial vacuum in an imprinting area is provided. This system can be used to create conductive traces in a substrate onto which integrated circuit chips and dies can be mounted to create semiconductor packages. A low pressure line evacuates air from a material receiving area of a vessel creating a pressure differential across pistons in the vessel to thereby causing the pistons to press microtools into impressionable material layers. The low pressure line helps the microtools conform to any thickness variations in the imprinted material and prevents air pockets from developing between the microtool and the imprinted material.

Abstract: A system to imprint patterns on impressionable materials by generating a pressure differential within an imprinting chamber by creating a substantial vacuum in an imprinting area is provided. This system can be used to create conductive traces in a substrate onto which integrated circuit chips and dies can be mounted to create semiconductor packages. A low pressure line evacuates air from a material receiving area of a vessel creating a pressure differential across pistons in the vessel to thereby causing the pistons to press microtools into impressionable material layers. The low pressure line helps the microtools conform to any thickness variations in the imprinted material and prevents air pockets from developing between the microtool and the imprinted material.

Abstract: A system to imprint patterns on impressionable materials by generating a pressure differential within an imprinting chamber by creating a substantial vacuum in an imprinting area is provided. This system can be used to create conductive traces in a substrate onto which integrated circuit chips and dies can be mounted to create semiconductor packages. A low pressure line evacuates air from a material receiving area of a vessel creating a pressure differential across pistons in the vessel thereby causing the pistons to press microtools into impressionable material layers. The low pressure line helps the microtools conform to any thickness variations in the imprinted material and prevents air pockets from developing between the microtool and the imprinted material.

Abstract: A micro tool alignment apparatus and method of use is described herein. The micro tool alignment apparatus coarsely aligns multiple imprinting micro tools to one another and includes a plurality of attachment features to facilitate attachment of the micro tool(s) to the alignment apparatus and to facilitate positioning of the micro tool(s) according to a first and a second degree of freedom. Alignment features associated with the micro tool alignment apparatus further facilitate positioning of the micro tool according to a third degree of freedom.