Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.

Abstract: Systems and methods for providing vibration isolation for a MEMS device are provided. In at least one embodiment, a system comprises a first assembly and a second assembly, wherein the second assembly and the first assembly are joined together, enclosing the MEMS device, wherein the joined first assembly and the second assembly have a recessed groove formed on an interior surface. Further, the system comprises a rigid support encircling the MEMS device, the rigid support fitting within the recessed groove; and at least one mount isolator in contact with a plurality of surfaces of the rigid support, wherein the at least one mount isolator interfaces the plurality of surfaces of the rigid support with the first assembly and the second assembly, when the first assembly and the second assembly are joined together.

Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.

Abstract: In one embodiment, a motion attenuating isolator is provided. A main portion of the isolator includes one or more members composed of an elastomeric material. The one or more members are configured to form an annular shape between an isolated portion and a non-isolated portion. The main portion defines one or more circumferential gaps within the annular shape. A plurality of sets of secondary features is disposed within the circumferential gaps. Secondary features in the plurality of sets of secondary features are composed of an elastomeric material, and each set of secondary features includes a first secondary feature that extends from the isolated portion and a second secondary feature that extends from the non-isolated portion of the system. Each first secondary feature is configured to engage with a corresponding second secondary feature during displacement of the isolated portion with respect to the non-isolated portion in a respective direction.

Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.

Abstract: A three-dimensional PWB is provided that may include two or more layers stacked together forming a top surface, a bottom surface, and one or more side surfaces, and one or more solder pad situated on at least one of the one or more side surfaces. The one or more solder pads may include exposed voids in the one or more side surfaces. In some cases, the top surface and/or the bottom surface may have one or more solder pad. The one or more solder pads on at least one of the one or more side surfaces may be electrically connected to the one or more solder pads on the top surface and/or the bottom surface. In the illustrative PWB, the top surface and/or the bottom surface may be adapted to be mounted with an inertial sensor. The one or more side surfaces may be adapted to be mounted to a printed wiring board.

Abstract: A packaging assembly includes a printed circuit assembly coupled to a stiffening device, which may take the form of a custom-shaped stiffening member or take the form of a support member having spokes attached to a rim. The printed circuit assembly includes a printed circuit board with a number of electrical components extending from a surface of the board. The stiffening member or the support member includes openings that receive the electrical components while providing additional stiffness to the board.

Abstract: Systems and methods for potted shock isolation are provided. In once embodiment a shock isolation system comprises an isolator comprising an outer ring for mounting to an external housing, and an inner ring connected to the outer ring via an isolating element; and an inertial sensing assembly comprising: at least one circuit board secured to the inner ring of the isolator, the at least one circuit board further comprising a triad of gyroscopes and a triad of accelerometers; and a low durometer highly dampened supporting material encapsulating a first surface of the at least one circuit board.

Abstract: Methods and apparatus for a MEMS sensor package are provided. In one embodiment, a MEMS sensor package comprises a MEMS sensor; a sensor body permeable to gas leakage at a first leak rate; a backfill gas that pressurizes the sensor body to a backfill pressure; wherein the backfill pressure provides a dampening of the MEMS sensor; and wherein the backfill pressure is set such than any increase in pressure within the sensor body due to gas leakage will not cause a deviation in a Q value of the MEMS sensor beyond a predefined range for at least a specified design service life for the MEMS sensor package.

Abstract: An inertial measurement unit includes a housing with openings to permit fluid communication between at least one pressure source and two distinct cavities within the housing. The cavities are separated by an inertial sensor assembly coupled to a vibration isolator assembly. The pressure in the cavities may be adjusted or tuned to change a natural frequency of the inertial measurement unit, thus allowing the unit to be configured and even optimized for a variety of different applications. By adjusting the pressure in the respective cavities, gas squeeze film damping effects may be optimized when the inertial measurement unit undergoes a shock event and/or when the inertial measurement unit experiences vibration loads during operation. In one embodiment, the vibration isolator assembly includes perforations to permit fluid communication between the first and second cavities during specific operational events.

Abstract: A packaging assembly includes a printed circuit assembly coupled to a stiffening device, which may take the form of a custom-shaped stiffening member or take the form of a support member having spokes attached to a rim. The printed circuit assembly includes a printed circuit board with a number of electrical components extending from a surface of the board. The stiffening member or the support member includes openings that receive the electrical components while providing additional stiffness to the board.

Abstract: Systems and methods for protecting a hardware device from shock loads in a package are disclosed. An example system includes a cover with an orifice at a first end and a closed second end, a cupped spring washer in the cover at the closed second end, a hardware package in the cover on the washer, and a base that, when attached to the cover, loads the washer and hardware package with a desired load.

Abstract: An inertial measurement unit (IMU) is provided that includes a container that defines a cavity. A sensor suit or ISA having a housing is provided in the container of the IMU. A dampening material is provided between the housing of the ISA and the container of the IMU. The dampening material may be applied by coating, spraying, or dipping, or may be separately molded and then inserted, if desired. A sway space may also be provided between the ISA and the IMU container.

Abstract: An inertial sensor system has a base, an inertial sensor, and an isolator mount. The isolator mount fastens the inertial sensor to the base, and the isolator mount includes a bolt and first and second vibration absorbing members. The bolt is inserted through the inertial sensor and the base, the first vibration absorbing member is between the bolt and the inertial sensor, and the second vibration absorbing member is between the inertial sensor and the base. The isolator mount isolates the inertial sensor from vibration, shock, and/or acoustic noise transmitted from a host system through the base.

Abstract: Disclosed is a compact vibration isolation system for mounting an inertial sensor assembly (ISA) to an Inertial Measurement Unit (IMU) housing. The housing is mounted to a support that is subjected to shock and vibration. The vibration isolator assembly includes a ring shaped elastomeric member laminated between a ring shaped inner member and a ring shaped outer member. The inner member is securely mounted to the ISA, and the outer member is mounted to a support of the IMU housing. Because of the compact size of this system, the IMU housing contains and protects the elastomeric member from potential contamination and damage, as well as eliminates the need for delicate mechanical and electrical interfaces. The elastomeric member of the system isolates the ISA from shock, vibration, and acoustic energy that may otherwise be transmitted from the support to the ISA.

Abstract: Disclosed is a compact vibration isolation system for mounting an inertial sensor assembly (ISA) to an Inertial Measurement Unit (IMU) housing. The housing is mounted to a support that is subjected to shock and vibration. The vibration isolator assembly includes a ring shaped elastomeric member laminated between a ring shaped inner member and a ring shaped outer member. The inner member is securely mounted to the ISA, and the outer member is mounted to a support of the IMU housing. Because of the compact size of this system, the IMU housing contains and protects the elastomeric member from potential contamination and damage, as well as eliminates the need for delicate mechanical and electrical interfaces. The elastomeric member of the system isolates the ISA from shock, vibration, and acoustic energy that may otherwise be transmitted from the support to the ISA.