Patents by Inventor Todd M. Fowler

Todd M. Fowler has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for controlling local current to achieve uniform plating thickness
    Patent number: 6896784
    Abstract: A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode. Positioned in the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface is a second cathode that includes a wire mesh screening portion having openings of different sizes conforming to the metallic features to be electroplated. The second cathode screening portion has openings of larger size adjacent areas of higher density of features to be electroplated and openings of smaller size adjacent areas of lower density of features to be electroplated.
    Type: Grant
    Filed: June 15, 2004
    Date of Patent: May 24, 2005
    Assignee: International Business Machines Corporation
    Inventors: Tien-Jen Cheng, Todd M. Fowler, Ajay P. Giri, Anton Nenadic, Blessen Samuel, Keith Kwong Hon Wong
  • Method and apparatus for controlling local current to achieve uniform plating thickness
    Patent number: 6890413
    Abstract: A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode. Positioned in the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface is a second cathode that includes a wire mesh screening portion having openings of different sizes conforming to the metallic features to be electroplated. The second cathode screening portion has openings of larger size adjacent areas of higher density of features to be electroplated and openings of smaller size adjacent areas of lower density of features to be electroplated.
    Type: Grant
    Filed: December 11, 2002
    Date of Patent: May 10, 2005
    Assignee: International Business Machines Corporation
    Inventors: Tien-Jen Cheng, Todd M. Fowler, Ajay P. Giri, Anton Nenadic, Blessen Samuel, Keith Kwong Hon Wong
  • Method and apparatus for controlling local current to achieve uniform plating thickness
    Publication number: 20040226826
    Abstract: A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode. Positioned in the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface is a second cathode that includes a wire mesh screening portion having openings of different sizes conforming to the metallic features to be electroplated. The second cathode screening portion has openings of larger size adjacent areas of higher density of features to be electroplated and openings of smaller size adjacent areas of lower density of features to be electroplated.
    Type: Application
    Filed: June 15, 2004
    Publication date: November 18, 2004
    Applicant: International Business Machines Incorporation
    Inventors: Tien-Jen Cheng, Todd M. Fowler, Ajay P. Giri, Anton Nenadic, Blessen Samuel, Keith Kwong Hon Wong
  • METHOD AND APPARATUS FOR CONTROLLING LOCAL CURRENT TO ACHIEVE UNIFORM PLATING THICKNESS
    Publication number: 20040115932
    Abstract: A process for electroplating metallic features of different density on a surface of a substrate comprises providing an electroplating bath having an anode, immersing the substrate into the electroplating bath, spaced from the anode, the substrate comprising a cathode. Positioned in the electroplating bath between the substrate and the anode, and adjacent to and separated from the substrate surface is a second cathode that includes a wire mesh screening portion having openings of different sizes conforming to the metallic features to be electroplated. The second cathode screening portion has openings of larger size adjacent areas of higher density of features to be electroplated and openings of smaller size adjacent areas of lower density of features to be electroplated.
    Type: Application
    Filed: December 11, 2002
    Publication date: June 17, 2004
    Applicant: International Business Machines Corporation
    Inventors: Tien-Jen Cheng, Todd M. Fowler, Ajay P. Giri, Anton Nenadic, Blessen Samuel, Keith Kwong Hon Wong