Patents by Inventor Todd Mark CUSHMAN

Todd Mark CUSHMAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEMS AND APPARATUS FOR CONTROLLING FLUID FLOW
    Publication number: 20250132170
    Abstract: Systems for processing articles are essential for semiconductor fabrication. These systems employ a variety of apparatuses for controlling flow. In one implementation, an apparatus for controlling flow may utilize a body having a flow path extending from an inlet to an outlet. A valve, a flow restrictor, and a pressure sensor are operably coupled to the flow path. The valve incorporates first and second actuators which enable control of mass flow rates of fluid flowing through the flow path.
    Type: Application
    Filed: October 14, 2024
    Publication date: April 24, 2025
    Applicant: Ichor Systems, Inc.
    Inventors: Philip Ryan Barros, Greg Patrick Mulligan, Christopher Bryant Davis, Randolph Treur, Gary Lei Xing, Todd Mark Cushman
  • METHOD OF MANUFACTURING SEMICONDUCTORS USING FLUID DELIVERY SYSTEM
    Publication number: 20240274444
    Abstract: A method of manufacturing a substrate block for a fluid delivery system is disclosed. First, a mold is provided, the mold having a cavity. The cavity of the mold is filled with a fluoropolymer to form a substrate block having an upper surface. A curved insert is withdrawn from the cavity to form a substrate fluid passageway extending from an inlet substrate port to an outlet substrate port. The substrate fluid passageway extends between the inlet substrate port and the outlet substrate port in a smooth arc free of corners or angular walls.
    Type: Application
    Filed: April 15, 2024
    Publication date: August 15, 2024
    Inventors: Chris MELCER, Philip Ryan BARROS, Haruyuki KUBOTA, Randolph TREUR, Todd Mark CUSHMAN
  • Method of manufacturing semiconductors using fluid delivery system
    Patent number: 12062553
    Abstract: A method of processing semiconductors using a fluid delivery system is disclosed in which seal inserts are utilized to fluidly connect an active component that bridges two substrate blocks.
    Type: Grant
    Filed: October 6, 2021
    Date of Patent: August 13, 2024
    Inventors: Chris Melcer, Phillip Ryan Barros, Haruyuki Kubota, Randolph Treur, Todd Mark Cushman
  • Method of manufacturing semiconductors using fluid delivery system
    Patent number: 11990354
    Abstract: A substrate block for a fluid delivery system is provided, the substrate block having an upper surface. The upper surface has an inlet substrate port and an outlet substrate port formed into the upper surface. A substrate fluid passageway extends from the inlet substrate port and the outlet substrate port. The substrate fluid passageway extends in a smooth arc which is free of corners or angular walls.
    Type: Grant
    Filed: August 12, 2022
    Date of Patent: May 21, 2024
    Inventors: Chris Melcer, Phillip Ryan Barros, Haruyuki Kubota, Randolph Treur, Todd Mark Cushman
  • METHOD OF MANUFACTURING SEMICONDUCTORS USING FLUID DELIVERY SYSTEM
    Publication number: 20220384217
    Abstract: A substrate block for a fluid delivery system is provided, the substrate block having an upper surface. The upper surface has an inlet substrate port and an outlet substrate port formed into the upper surface. A substrate fluid passageway extends from the inlet substrate port and the outlet substrate port. The substrate fluid passageway extends in a smooth arc which is free of corners or angular walls.
    Type: Application
    Filed: August 12, 2022
    Publication date: December 1, 2022
    Inventors: Chris MELCER, Phillip Ryan BARROS, Haruyuki KUBOTA, Randolph TREUR, Todd Mark CUSHMAN
  • METHOD OF MANUFACTURING SEMICONDUCTORS USING FLUID DELIVERY SYSTEM
    Publication number: 20220028705
    Abstract: A method of processing semiconductors using a fluid delivery system is disclosed in which seal inserts are utilized to fluidly connect an active component that bridges two substrate blocks.
    Type: Application
    Filed: October 6, 2021
    Publication date: January 27, 2022
    Inventors: Chris MELCER, Phillip Ryan BARROS, Haruyuki KUBOTA, Randolph TREUR, Todd Mark CUSHMAN