Abstract: A high retention force fastener for fixing at least two panels together is disclosed. The fastener includes two components. One component is a metal clip and the other is a plastic insert that can be substantially inserted into the metal clip. The metal clip includes a body having opposed panel engagement features extending therefrom, an insertion stop plate spaced apart from the engagement features and plastic insert locking tabs extending from the stop plate. The metal clip is preferably U-shaped and includes two sides joined by a connector. Each of the sides includes a pair of the panel engagement features. The plastic insert includes a head and a leg for insertion into the metal clip. The leg extends from the head. The plastic insert additionally includes metal tab engagement arms extending from and integrally formed with the head for engaging the plastic insert locking tabs of the metal clip.

Abstract: A high retention force fastener for fixing at least two panels together is disclosed. The fastener includes two components. One component is a metal clip and the other is a plastic insert that can be substantially inserted into the metal clip. The metal clip comprises a body having opposed panel engagement features extending therefrom, an insertion stop plate spaced apart from the engagement features and plastic insert locking tabs extending from the stop plate. The metal clip is preferably U-shaped and comprises two sides joined by a connector. Each of the sides includes a pair of the panel engagement features. The plastic insert comprises a head and a leg for insertion into the metal clip. The leg extends from the head. The plastic insert additionally includes metal tab engagement arms extending from and integrally formed with the head for engaging the plastic insert locking tabs of the metal clip.

Abstract: Systems and methods are disclosed to enhance three-dimensional photoacoustic imaging behind, through, or inside a scattering material. Some embodiments can increase the optical fluence in an ultrasound transducer focus and/or enhance the optical intensity using wavefront shaping before the scatterer. The photoacoustic signal induced by an object placed behind the scattering medium can serve as feedback to optimize the wavefront, enabling one order of magnitude enhancement of the photoacoustic amplitude. Using the enhanced optical intensity, the object can be scanned in two dimensions and/or a spot can be scanned by re-optimizing the wavefront before post-processing of the data to reconstruct the image. The temporal photoacoustic signal provides information to reconstruct the third-dimensional information.

Abstract: A system and method for identifying one or more characteristics of a structure formed into a substrate is herein disclosed. Surface and bulk acoustic waves are induced in the substrate and travel past a structure of interest where the acoustic waves are sensed. Information concerning one or more characteristics of the structure is encoded in the wave. The encoded information is assessed to determine the characteristic of interest.

Abstract: A smart material actuated fastener is provided. In another aspect, a fastener includes a shape memory material and a non-shape memory material with the shape memory material being a minority of the total fastener materials. A further aspect provides a fastener having workpiece-engaging surfaces made of an inactive and non-shape memory material.

Abstract: A smart material actuated fastener is provided. In another aspect, a fastener includes a shape memory material and a non-shape memory material with the shape memory material being a minority of the total fastener materials. A further aspect provides a fastener having workpiece-engaging surfaces made of an inactive and non-shape memory material.

Abstract: A smart material actuated fastener is provided. In another aspect, a fastener includes a shape memory material and a non-shape memory material with the shape memory material being a minority of the total fastener materials. A further aspect provides a fastener having workpiece-engaging surfaces made of an inactive and non-shape memory material.

Abstract: Systems and methods are disclosed to enhance three-dimensional photoacoustic imaging behind, through, or inside a scattering material. Embodiments of the invention can increase the optical fluence in an ultrasound transducer focus and/or enhance the optical intensity using wavefront shaping before the scatterer. The photoacoustic signal induced by an object placed behind the scattering medium can serve as feedback to optimize the wavefront, enabling one order of magnitude enhancement of the photoacoustic amplitude. Using the enhanced optical intensity, the object can be scanned in two dimensions and/or a spot can be scanned by re-optimizing the wavefront before post-processing of the data to reconstruct the image. The temporal photoacoustic signal provides information to reconstruct the third-dimensional information.

Abstract: A fastener is provided. In another aspect, a fastener is made of layers of material, a light curable material and/or multiple built-up materials. Another aspect uses a three-dimensional printing machine to emit material from an ink jet printing head to build up a fastener.

Abstract: A smart material actuated fastener is provided. In another aspect, a fastener includes a shape memory material and a non-shape memory material with the shape memory material being a minority of the total fastener materials. A further aspect provides a fastener having workpiece-engaging surfaces made of an inactive and non-shape memory material.

Abstract: A system and method for identifying one or more characteristics of a structure formed into a substrate is herein disclosed. Surface and bulk acoustic waves are induced in the substrate and travel past a structure of interest where the acoustic waves are sensed. Information concerning one or more characteristics of the structure is encoded in the wave. The encoded information is assessed to determine the characteristic of interest.

Abstract: An access port cover is described. The access sport cover may seal an aperture located in a vehicle body whereby the access port cover may also provide access to a terminal located within the body. The access port cover may include a cover, a hinge mechanism and a linkage mechanism. The cover may include an outer portion and an inner portion, wherein the inner portion may include a first and a second end. The hinge mechanism may be located on each end of the inner portion. The linkage mechanism may be connected to the hinge mechanism, wherein the linkage mechanism may the said cover towards and away from the aperture. The cover and the linkage mechanism may be rotated into and stored within the body when the cover is not sealing the aperture in a closed position.

Abstract: A fastener is provided. In another aspect, a fastener is made of layers of material, a light curable material and/or multiple built-up materials. Another aspect uses a three-dimensional printing machine to emit material from an ink jet printing head to build up a fastener.

Abstract: A smart material actuated fastener is provided. In another aspect, a fastener includes a shape memory material and a non-shape memory material with the shape memory material being a minority of the total fastener materials. A further aspect provides a fastener having workpiece-engaging surfaces made of an inactive and non-shape memory material.

Abstract: A clamp forming apparatus capable of forming a clamp is shown and described. The clamp formed may have first and second engaging portions. The clamp forming apparatus may include at least one securing member. The clamp forming apparatus may also include a clamp positioning device operatively engaged with the at least one securing member, where at least one of the first or second engaging portions is supported by the clamp positioning device, and where a tangential load is applied around a circumference of the clamp and the at least one securing member secures at least one of the engaging portions of the clamp together in a direction generally normal to the tangential load.

Abstract: An attachment system is provided. In another aspect, an elongated member is inserted through support assembly to secure the support assembly to a building roof. Another aspect employs a bracket having a guide pin that engages a pin receptacle on a stand as the bracket is lowered onto the stand. A method of attaching a solar panel to a building is additionally provided.

Abstract: A device detects underfill voids and solder ball defects via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using probe and detection beams of different wavelengths. Resolution of less than 100 ?m features was demonstrated for silicon flip chips.

Abstract: An access port cover is described. The access sport cover may seal an aperture located in a vehicle body whereby the access port cover may also provide access to a terminal located within the body. The access port cover may include a cover, a hinge mechanism and a linkage mechanism. The cover may include an outer portion and an inner portion, wherein the inner portion may include a first and a second end. The hinge mechanism may be located on each end of the inner portion. The linkage mechanism may be connected to the hinge mechanism, wherein the linkage mechanism may the said cover towards and away from the aperture. The cover and the linkage mechanism may be rotated into and stored within the body when the cover is not sealing the aperture in a closed position.

Abstract: A device detects underfill voids and solder ball defects via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using probe and detection beams of different wavelengths. Resolution of less than 100 ?m features was demonstrated for silicon flip chips.

Abstract: Underfill voids and solder ball defects are detected via laser generation and laser detection of an ultrasonic wave at the top surface of flip chips. High resolution is provided by using small laser spot sizes and closely-spaced laser beams of wavelengths that are absorbed near the surface of the semiconductor. Alternatively, the generation laser beam may be absorbed in the bulk of the semiconductor. Improved spatial resolution and rejection of unwanted scattered waves can be attained by limiting the time frame of the ultrasonic waveform to the time required for the first longitudinal wave reflection from the bottom of the flip chip. The laser beam spacing can be reduced by using overlapping probe and detection beams of different wavelengths. Resolution of less than 100 ?m features was demonstrated for silicon flip chips.