Abstract: An electronic shunt resistor assembly comprises a planar shunt resistor and an electronic monitoring unit. The planar shunt resistor has a resistance element and first and second terminal bars at opposite ends of the resistance element. The electronic measuring unit has a circuit board that is supported on the planar shunt resistor and that includes input contacts for electronic components carried by the circuit board arranged along one edge of the circuit board and input/output contacts for the electronic components arranged along a opposite edge of the circuit board. A first plurality of electrical connectors connect the first terminal bar to the input contacts and a second plurality of electrical connectors connect the second terminal bar to the output contacts of the circuit board. The electrical connectors are attached to the terminal bars and the contacts solderlessly.

Abstract: An electronics assembly is provided having a heat pipe device for cooling electronics. The assembly includes a substrate and an electronics package supported on the substrate. The assembly also includes a heat pipe device in thermal communication with an exposed surface of the electronics package. The heat pipe device includes a thermal conductive pipe having an internal volume and an open end. The heat pipe device also includes a thermal conductive end cap positioned to close the open end of the pipe. The end cap has an outer surface for receiving in thermal communication an electronics package. The heat pipe device further includes a cooling fluid disposed in the internal volume of the pipe for transferring thermal energy from the end cap to the outside environment.

Abstract: A LED array cooling system including a LED array and a substrate attached to the LED array wherein the LED array includes a plurality of walls that at least in part define a plurality of passages through the LED array.

Abstract: A technique for defining a wettable solder joint area for an electronic assembly reduces and/or dispenses with the use of polymer solder masks. According to the technique, a substrate is provided that includes at least one conductive trace. A nickel layer is provided on the conductive trace and gold is selectively applied on the nickel layer in a desired pattern to form a gold layer. An exposed portion of the nickel layer that does not include the gold in the desired pattern is then oxidized. Finally, a solder is applied to the gold layer, with the oxidized nickel layer providing a solder stop and defining a wettable solder joint area.

Abstract: A solderable bar bond connector establishes a primary interconnect between a substrate and a high current terminal of an IC chip mounted on the substrate, and one or more secondary interconnects between the substrate and low current terminals of the IC chip. The bar bond connector includes a plate portion soldered to the high current terminal of the IC chip and a plurality of leg elements extending from the plate portion to multiple bond sites on the substrate. The underside of at least one leg element is provided with a secondary circuit including a conductor that is electrically isolated from the respective leg element. The conductor of the secondary circuit is soldered to both the substrate and a low current terminal of the IC chip for establishing a secondary interconnect in addition to the primary interconnect established by the plate portion and the other leg elements.

Abstract: Thermally managing high-power IC devices through the use of a circuit assembly comprising a ceramic substrate and an organic substrate. The ceramic substrate has at least one circuit component on a first surface thereof and a periphery defining a lateral surface surrounding the first surface. The organic substrate also comprises a first surface and a periphery defining a lateral surface surrounding the first surface. A portion of the lateral surface of the organic substrate is adjacent a portion of the lateral surface of the ceramic substrate so as to define an interface therebetween. At least one conductor common to both the ceramic and organic substrates and bridging the interface therebetween serves to physically connect the ceramic and organic substrates together.

Abstract: An electronic module and method that enable circuitry required by one form of the module (e.g., a developmental unit) to be omitted in a second form of the module (e.g., a production unit), without necessitating additional changes in the module. The electronic module includes a motherboard, a multichip module (MCM) mounted to the motherboard, and a circuit unit connected to the MCM. The circuit unit comprises a flexible substrate, instrumentation circuitry mounted on the flexible substrate, and a connector coupled to the flexible substrate. The flexible substrate has signal lines that electrically communicate with the MCM, the instrumentation circuitry, and the connector. A portion of the flexible substrate is located between the MCM and the motherboard and permits electrical communication therebetween. The instrumentation circuitry does not occupy space on the motherboard.

Abstract: A heat sinkable package that includes a power device package including an active side and a non-active side is disclosed. The non-active side includes a heat sinkable surface positioned adjacent to a product case. Another embodiment of the invention is directed to a method for manufacturing a heat sinkable package. The method comprises the steps of placing at least one flip chip over a flexible circuit within a mold tool; compensating for height variances of the flip chips; and positioning an input/output on an active side of the power device package opposite a non-active side of the power device package.

Abstract: A thermally enhanced electronic module includes a thermally conductive case, a self-aligning thermally conductive heat sink and a die. The case includes a pivot area with a first shape formed into the case for receiving a first portion of the heat sink and a first portion of the heat sink has a second shape that is complementary to the first shape. The die includes a first surface and a second surface opposite the first surface. The die is mounted to a substrate with the first surface of the die facing the substrate and the second surface of the die is in thermal contact with the heat sink.