Patents by Inventor Todd P. Luckanc

Todd P. Luckanc has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dual damascene using removable via studs
    Publication number: 20020164544
    Abstract: A dual damascene process is described. A sacrificial post is formed using a photolithographic process which may include exposing photoresist through a bright field photomask. An interlevel dielectric, such as a low-k dielectric, is formed on the post, and a trench etched exposing the post. The post is then removed, thereby forming a hole. A conducting layer is then formed in the hole and the trench.
    Type: Application
    Filed: May 2, 2001
    Publication date: November 7, 2002
    Applicant: ADVANCED MICRO DEVICES, INC.
    Inventors: Todd P. Luckanc, Scott A. Bell, Christopher F. Lyons, Marina V. Plat, Ramkumar Subramanian