Abstract: A fast and reliable single or dual transfer process is provided. Unlike prior art foil transfer techniques, which rely on the very fragile nature of the transferred pattern and/or shape to obtain a clean break at the die edge, the present invention is directed toward relatively non-tearable or tear resistant materials that can be difficult or impossible to effectively transfer using these known foil transfer techniques. This problem is addressed by precision cutting, for example, patches in the relatively non-tearable or tear resistant material positioned on a carrier substrate and in one exemplary embodiment transferring areas surrounding the cut patches to a sacrificial carrier substrate. The resulting sharply defined, precision cut patches left on the carrier substrate may then be transferred to objects to be protected such as banknotes.