Patents by Inventor Todd Sean Harple

Todd Sean Harple has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • 3D printed sensor and cushioning material
    Patent number: 10542624
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed relating to 3D-printed structures. An example method of building a sensor with a 3D printer includes building a first conductive substrate and building a second conductive substrate. The example method also includes building a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a first latticed structure including a first plurality of legs extending inwardly at a first angle and a second latticed structure including a second plurality of legs extending inwardly at a second angle.
    Type: Grant
    Filed: May 2, 2019
    Date of Patent: January 21, 2020
    Assignee: Intel Corporation
    Inventors: Todd Sean Harple, Francis Anthony Bitonti, Peter Emery Wildfeuer
  • 3D PRINTED SENSOR AND CUSHIONING MATERIAL
    Publication number: 20190261510
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed relating to 3D-printed structures. An example method of building a sensor with a 3D printer includes building a first conductive substrate and building a second conductive substrate. The example method also includes building a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a first latticed structure including a first plurality of legs extending inwardly at a first angle and a second latticed structure including a second plurality of legs extending inwardly at a second angle.
    Type: Application
    Filed: May 2, 2019
    Publication date: August 22, 2019
    Inventors: Todd Sean Harple, Francis Anthony Bitonti, Peter Emery Wildfeuer
  • 3D printed sensor and cushioning material
    Patent number: 10285267
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed relating to 3D-printed structures. An example 3D-printed structure includes a first conductive substrate, a second conductive substrate and a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a latticed structure having a first stiffness in a first direction and a second stiffness in a second direction different than the first direction.
    Type: Grant
    Filed: August 17, 2017
    Date of Patent: May 7, 2019
    Assignee: Intel Corporation
    Inventors: Todd Sean Harple, Francis Anthony Bitonti, Peter Emery Wildfeuer
  • 3D PRINTED SENSOR AND CUSHIONING MATERIAL
    Publication number: 20190059155
    Abstract: Methods, apparatus, systems and articles of manufacture are disclosed relating to 3D-printed structures. An example 3D-printed structure includes a first conductive substrate, a second conductive substrate and a dielectric structure between the first conductive substrate and the second conductive substrate, the dielectric structure including a latticed structure having a first stiffness in a first direction and a second stiffness in a second direction different than the first direction.
    Type: Application
    Filed: August 17, 2017
    Publication date: February 21, 2019
    Inventors: Todd Sean Harple, Francis Anthony Bitonti, Peter Emery Wildfeuer