Abstract: A method of semiconductor modelling includes determining for a virtual model of a layer of a semiconductor package, wherein the layer includes a metal layer, one or more first regions of the layer that do not satisfy a first layer design rule; adding first voids to the one or more first regions to satisfy the first layer design rule; determining for the layer including the metal pattern and the first voids, one or more second regions of the layer that do not satisfy a second layer design rule, different from the first layer design rule; and adding second voids to the one or more second regions to satisfy the second layer design rule.

Abstract: A hydraulic circuit for use on a construction machine includes a first valve, a second valve, and at least a third valve. The second and third valve each includes at least one inlet port connected to a first outlet port of the first valve. The first outlet port of each of the second and third valves are configured to reduce a first pressure to a second pressure and/or a third pressure downstream of the second valve and the third valve, respectively. The second valve and the third valve also include at least a second outlet port connected to a reservoir tank. A hydraulic motor is connected to the first outlet port of the second valve, which operates the hydraulic motor in a first direction. The hydraulic motor also is connected to the first outlet port of the third valve, which operates the hydraulic motor in a second direction.

Abstract: A hydraulic circuit for use on a construction machine includes a first valve, a second valve, and at least a third valve. The second and third valve each includes at least one inlet port connected to a first outlet port of the first valve. The first outlet port of each of the second and third valves are configured to reduce a first pressure to a second pressure and/or a third pressure downstream of the second valve and the third valve, respectively. The second valve and the third valve also include at least a second outlet port connected to a reservoir tank. A hydraulic motor is connected to the first outlet port of the second valve, which operates the hydraulic motor in a first direction. The hydraulic motor also is connected to the first outlet port of the third valve, which operates the hydraulic motor in a second direction.

Abstract: A hydraulic circuit for use on a construction machine includes a first valve, a second valve, and at least a third valve. The second and third valve each includes at least one inlet port connected to a first outlet port of the first valve. The first outlet port of each of the second and third valves are configured to reduce a first pressure to a second pressure and/or a third pressure downstream of the second valve and the third valve, respectively. The second valve and the third valve also include at least a second outlet port connected to a reservoir tank. A hydraulic motor is connected to the first outlet port of the second valve, which operates the hydraulic motor in a first direction. The hydraulic motor also is connected to the first outlet port of the third valve, which operates the hydraulic motor in a second direction.

Abstract: A hydraulic circuit for use on a construction machine includes a first valve, a second valve, and at least a third valve. The second and third valve each includes at least one inlet port connected to a first outlet port of the first valve. The first outlet port of each of the second and third valves are configured to reduce a first pressure to a second pressure and/or a third pressure downstream of the second valve and the third valve, respectively. The second valve and the third valve also include at least a second outlet port connected to a reservoir tank. A hydraulic motor is connected to the first outlet port of the second valve, which operates the hydraulic motor in a first direction. The hydraulic motor also is connected to the first outlet port of the third valve, which operates the hydraulic motor in a second direction.

Abstract: A piston type compressor wherein the position of the piston highest pressure point is indicated and the rotor of the motor at the optimal starting angle aligned prior to the actual compression operation by providing a pre-pulse to rotate the rotor of the motor at least one full rotation at a certain frequency, during rotation measuring the load torque by the frequency converter as well as indicating the maximum load torque point and at the end aligning the rotor of the motor at the optimal starting angle of about 180° from the maximum pressure angle, and at the beginning of the actual compression operation setting the rotor position opposite to the maximum torque angle by feeding direct current to the stator winding and starting the motor by supplying maximum motor current to the motor to give the maximum torque and acceleration.

Abstract: A piston type compressor wherein the position of the piston highest pressure point is indicated and the rotor of the motor at the optimal starting angle aligned prior to the actual compression operation by providing a pre-pulse to rotate the rotor of the motor at least one full rotation at a certain frequency, during rotation measuring the load torque by the frequency converter as well as indicating the maximum load torque point and at the end aligning the rotor of the motor at the optimal starting angle of about 180° from the maximum pressure angle, and at the beginning of the actual compression operation setting the rotor position opposite to the maximum torque angle by feeding direct current to the stator winding and starting the motor by supplying maximum motor current to the motor to give the maximum torque and acceleration.

Abstract: In the present electronic structure, a substrate is provided in the form of a circuit board. First and second electronic devices are positioned on opposite sides of the circuit board, each having a plurality of contacts connected to the circuit board. Each of the contacts of the first device is connected to a contact of the second device by a connector though the circuit board. At least one of the contacts of the first device is connected to the contact of the second device which is most adjacent to that contact of the first device across the circuit board.

Abstract: An album frame is provided having an outer frame. The outer frame has a back side and an outer periphery. A mounting plate is attached to the back side of the outer frame. A support shelf extends frontwardly from the mounting plate along a first portion of the inner periphery. The support shelf is adapted to support a binding of an album. In addition, the outer frame may have a recessed groove in a second portion of the inner periphery. The second portion is located opposite the first portion of the inner periphery. Furthermore, the outer frame may include a first guiding ramp on a third portion of the inner periphery and a second guiding ramp on a fourth portion of the inner periphery. The first guiding ramp and the second guiding ramp allows an edge of an album cover to be guided into the recessed groove.

Abstract: A wire bond circuit device has a circuit die in which substantially all of the input/output (I/O) pads are disposed along the outermost row of pads. A substrate onto which the die is disposed has wedges that are similarly arranged in rows, with the wedges used to carry I/O placed closest to the circuit die. As a result, lowest-tiered bond wire is used to connect the I/O-related pads to their respective wedges.

Abstract: In the present electronic structure, a substrate is provided in the form of a circuit board. First and second electronic devices are positioned on opposite sides of the circuit board, each having a plurality of contacts connected to the circuit board. Each of the contacts of the first device is connected to a contact of the second device by a connector though the circuit board. At least one of the contacts of the first device is connected to the contact of the second device which is most adjacent to that contact of the first device across the circuit board.

Abstract: An album frame is provided having an outer frame. The outer frame has a back side and an outer periphery. A mounting plate is attached to the back side of the outer frame. A support shelf extends frontwardly from the mounting plate along a first portion of the inner periphery. The support shelf is adapted to support a binding of an album. In addition, the outer frame may have a recessed groove in a second portion of the inner periphery. The second portion is located opposite the first portion of the inner periphery. Furthermore, the outer frame may include a first guiding ramp on a third portion of the inner periphery and a second guiding ramp on a fourth portion of the inner periphery. The first guiding ramp and the second guiding ramp allows an edge of an album cover to be guided into the recessed groove.

Abstract: A wire bond circuit device has a circuit die in which substantially all of the input/output (I/O) pads are disposed along the outermost row of pads. A substrate onto which the die is disposed has wedges that are similarly arranged in rows, with the wedges used to carry I/O placed closest to the circuit die. As a result, lowest-tiered bond wire is used to connect the I/O-related pads to their respective wedges.