Patents by Inventor Todd Spencer
Todd Spencer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20260026411Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: ApplicationFiled: September 26, 2025Publication date: January 22, 2026Inventors: Robert L. SANKMAN, Sairam AGRAHARAM, Shengquan OU, Thomas J DE BONIS, Todd SPENCER, Yang SUN, Guotao WANG
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Patent number: 12476235Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: GrantFiled: December 27, 2023Date of Patent: November 18, 2025Assignee: Intel CorporationInventors: Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J De Bonis, Todd Spencer, Yang Sun, Guotao Wang
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Patent number: 12199085Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: GrantFiled: April 8, 2022Date of Patent: January 14, 2025Assignee: Intel CorporationInventors: Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J De Bonis, Todd Spencer, Yang Sun, Guotao Wang
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Publication number: 20240128256Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: ApplicationFiled: December 27, 2023Publication date: April 18, 2024Inventors: Robert L. SANKMAN, Sairam AGRAHARAM, Shengquan OU, Thomas J. DE BONIS, Todd SPENCER, Yang SUN, Guotao WANG
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Patent number: 11817444Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: GrantFiled: January 28, 2022Date of Patent: November 14, 2023Assignee: Intel CorporationInventors: Robert L Sankman, Sairam Agraharam, Shengquan Ou, Thomas J De Bonis, Todd Spencer, Yang Sun, Guotao Wang
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Publication number: 20220231007Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: ApplicationFiled: April 8, 2022Publication date: July 21, 2022Inventors: Robert L. SANKMAN, Sairam AGRAHARAM, Shengquan OU, Thomas J. DE BONIS, Todd SPENCER, Yang SUN, Guotao WANG
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Patent number: 11348911Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: GrantFiled: June 4, 2020Date of Patent: May 31, 2022Assignee: Intel CorporationInventors: Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J De Bonis, Todd Spencer, Yang Sun, Guotao Wang
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Publication number: 20220157803Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: ApplicationFiled: January 28, 2022Publication date: May 19, 2022Inventors: Robert L. SANKMAN, Sairam AGRAHARAM, Shengquan OU, Thomas J DE BONIS, Todd SPENCER, Yang SUN, Guotao WANG
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Publication number: 20200395352Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: ApplicationFiled: June 4, 2020Publication date: December 17, 2020Inventors: Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun, Guotao Wang
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Patent number: 10700051Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: GrantFiled: June 4, 2018Date of Patent: June 30, 2020Assignee: Intel CorporationInventors: Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J De Bonis, Todd Spencer, Yang Sun, Guotao Wang
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Publication number: 20190371778Abstract: An electronic device may include a first die that may include a first set of die contacts. The electronic device may include a second die that may include a second set of die contacts. The electronic device may include a bridge interconnect that may include a first set of bridge contacts and may include a second set of bridge contacts. The first set of bridge contacts may be directly coupled to the first set of die contacts (e.g., with an interconnecting material, such as solder). The second set of bridge contacts may be directly coupled to the second set of die contacts (e.g., with solder). The bridge interconnect may help facilitate electrical communication between the first die and the second die.Type: ApplicationFiled: June 4, 2018Publication date: December 5, 2019Inventors: Robert L. Sankman, Sairam Agraharam, Shengquan Ou, Thomas J. De Bonis, Todd Spencer, Yang Sun, Guotao Wang
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Publication number: 20170158148Abstract: A license plate handle bracket is provided herein, The license plate handle bracket may be configured for attaching with a license plate to a vehicle trunk lid. The bracket may include a backer and an extension. The backer may be configured to receive a license plate and mount onto a vehicle trunk lid. The extension may point outwardly from the backer. The extension may extend a sufficient distance and in a direction that forms a finger-engagement feature beyond a thickness of the license plate. The extension may form a sufficiently strong platform for a user to engage and apply a sufficient force to the extension in order to manipulate the trunk lid.Type: ApplicationFiled: December 8, 2015Publication date: June 8, 2017Inventors: Todd Spencer, Timothy Nevin, Dave Heberly
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Patent number: D739800Type: GrantFiled: March 17, 2014Date of Patent: September 29, 2015Assignee: Cruiser Accessories, LLCInventors: Todd Spencer, Eldon Goates, Bret Zelenka
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Patent number: D752493Type: GrantFiled: March 17, 2014Date of Patent: March 29, 2016Assignee: Cruiser Accessoies, LLCInventors: Todd Spencer, Eldon Goates, Bret Zelenka, Michael J. Schwartz
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Patent number: D780650Type: GrantFiled: May 28, 2015Date of Patent: March 7, 2017Assignee: Cruiser Accessories, LLCInventors: Todd Spencer, Timothy J. Nevin, Michael J. Schwartz
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Patent number: D780651Type: GrantFiled: June 30, 2015Date of Patent: March 7, 2017Assignee: Cruiser Accessories, LLCInventors: Todd Spencer, Michael J. Schwartz, Eldon Goates, Bret Zelenka
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Patent number: D813130Type: GrantFiled: October 18, 2016Date of Patent: March 20, 2018Assignee: Cruiser Accessories, LLCInventors: Todd Spencer, Michael J. Schwartz, Eldon Goates, Bret Zelenka, Sandy O'Neill, George Sivy
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Patent number: D824307Type: GrantFiled: September 4, 2017Date of Patent: July 31, 2018Assignee: Cruiser Accessories, LLCInventors: Todd Spencer, Eldon L. Goates, Mark Hunter Basenberg, Jr.
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Patent number: D824801Type: GrantFiled: October 18, 2016Date of Patent: August 7, 2018Assignee: Cruiser Accessories, LLCInventors: Todd Spencer, Timothy Nevin
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Patent number: D834479Type: GrantFiled: December 6, 2017Date of Patent: November 27, 2018Assignee: Cruiser Accesories, LLCInventor: Todd Spencer