Abstract: A radio frequency switch assembly (120) is mountable between an antenna port (110) and a detachable antenna (130) of a radio communication device assembly (100) to provide an interface for a radio frequency accessory. The switch assembly (120) has a radio interface port (123), a radio frequency accessory port (125), and an antenna interface port (127), and associated contacts (207, 216, 223). A mechanical switch alternatively interconnects the radio interface port (123) with the radio frequency accessory port (125) or with the antenna interface port (127). Preferably, the switch includes a conductive probe (213) that continuously engages the radio interface port contact (207) while being slidable to electrically interconnect with the antenna interface port contact (223) or with the radio frequency accessory port contact (216).

Abstract: The molded key switch shield assembly (100) includes a molded member (104) and a key switch overlay (102). The molded member (104) includes a shield metallization pattern (136) which substantially covers major portions of both the first (138) and second major surfaces (140) of the molded member (104). The molded member also includes a metallization pattern (124) having a plurality of key switch locations (118) which can be shorted by conductive locations (112) on key switch overlay (102).

Abstract: A shielded low-profile electronic component assembly 100 providing shielding for electronic components is disclosed which includes a substrate 124, and shield 102. In a first embodiment the shield 102 is chamfered at each shield corner 110 and is attached to the substrate 124 at ground pad patterns 114, which are found at each corner of the substrate 124 on surface 128. A ground paddle 120 is also located in substrate 124 which lies substantially underneath the electronic component 112, and is utilized in maximizing shielding. In an alternate embodiment a substrate 124 is overmolded with encapsulation material 302 after the electronic component 112 is affixed to the substrate 124, with each of the encapsulation material corners 306 being chamfered exposing ground pads 114. The metallized shield 310 is then placed over the overmolded encapsulant and attached to the substrate 124 at ground pad patterns 114. The overmolded encapsulant 302 adding protection to the electronic component 112.