Patents by Inventor Todd W. Steigerwald

Todd W. Steigerwald has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6542380
    Abstract: A Method and system of routing noise current from noise generating devices in an electronic or electrical system is disclosed. The method and system includes dielectric structures that route noise current from noise generating devices back to the noise generating device in which the noise originates by way of a return path. The dielectric structures provide for the return paths.
    Type: Grant
    Filed: October 15, 2001
    Date of Patent: April 1, 2003
    Assignee: Dell Products, L.P.
    Inventors: Jeffrey C. Hailey, Todd W. Steigerwald
  • Patent number: 6337798
    Abstract: A printed circuit board assembly characterized by at least two decoupling capacitors for decoupling transient currents resulting from, for example, logic transitions in high-speed digital circuitry. The decoupling capacitors are physically arranged, and electrically connected between a power plane and a ground plane, so that transient currents flow in respectively opposite directions through the capacitors, thereby maximizing the capacitors' mutual inductance, and thus minimizing the electromagnetic interference generated by the capacitors.
    Type: Grant
    Filed: January 25, 2000
    Date of Patent: January 8, 2002
    Assignee: Dell USA, L.P.
    Inventors: Jeffrey C. Hailey, Todd W. Steigerwald
  • Patent number: 6150895
    Abstract: A circuit board having a transition region at its perimeter. The transition region provides a deliberate increase in impedance between the voltage and ground plane from the interior side of the transition region where the board impedance is approximately that of the board impedance at an interior region of the circuit board to the edge side of the transition region where the impedance level approximates or is slightly less than that of surrounding air. In one example, the voltage plane in the transition region has a geometric configuration that provides a decrease in plane material (such as a hole, stripe, or triangle pattern) from the interior side to the edge side of the transition region. With other examples, the distance between the voltage and ground plane increases from the interior side to the edge side of the transition region.
    Type: Grant
    Filed: January 25, 1999
    Date of Patent: November 21, 2000
    Assignee: Dell USA, L.P.
    Inventors: Todd W. Steigerwald, Mitchell C. Sebring
  • Patent number: 5912809
    Abstract: Electrical potentials and very high frequency (VHF) currents in a circuit board are controlled by patterning the power plane of a multiple layered, capacitive plane printed circuit board in selected geometric patterns. The selected geometric patterns, both simple and complex, control voltages and currents by channeling the capacitance capacity for usage directed to a particular integrated circuit or circuits, isolated to a particular integrated circuit or circuits, or shared between integrated circuits. Accordingly, the capacitive planes including the geometrically patterned power plane are channeled capacitive planes (CCP) that are formed on multiple layers of a single printed circuit board to support flexible, three-dimensional control of VHF electrical currents.
    Type: Grant
    Filed: January 21, 1997
    Date of Patent: June 15, 1999
    Assignee: Dell USA, L.P.
    Inventors: Todd W. Steigerwald, Leroy Jones
  • Patent number: 5500789
    Abstract: Transverse electromagnetic mode (TEM) radiation emitted from a side edge portion of a circuit board substrate portion during operation of the circuit board is intercepted by a specially designed shield structure carried by the substrate side edge portion, and the intercepted radiation is conductively returned to the substrate ground plane, through a relatively short grounding path, for return to the emitting source(s). In one form thereof, the shield is a copper plating material extending along and covering the substrate side edge portion and adjacent peripheral portions of the opposite sides of the substrate. In another form thereof, the shield is a snap-on metal shield structure that is removably mounted around the substrate side edge portion. The shield may be electrically coupled to the substrate ground plane by directly contacting a ground plane edge portion with the copper plating, using a filter structure to couple the shield to the ground plane, or otherwise using an external grounding path.
    Type: Grant
    Filed: December 12, 1994
    Date of Patent: March 19, 1996
    Assignee: Dell USA, L.P.
    Inventors: Kevin L. Miller, Robert L. McMahan, Todd W. Steigerwald