Abstract: Methods and apparatus are provided for efficiently generating test components for testing and evaluating a design under test. As a design is being configured, generated test components are made available. In one example, test components are automatically generated and included in a simulation testbench based on selected components in the design. Generally, the test components complement the selected components in the design. Moreover, the test components can be automatically seeded with initial contents.

Abstract: Methods and apparatus are provided for testing logic, particularly arbitration logic on a programmable chip. Secondary components on a programmable chip are configured with delay mechanisms operable to pseudo-randomly delay responses to requests received using arbitration logic. Requests are typically generated by primary components. The delay mechanisms can be used to test the ability of a programmable chip system to handle a variety of secondary component wait-state and latency characteristics. The delay mechanism can also be used to improve system performance.

Abstract: Methods and apparatus are provided for implementing a programmable device including a processor core, a hardware accelerator, and secondary components such as memory. A portion of a program written in a high-level language is automatically selected for hardware acceleration. Dedicated ports are generated to allow the hardware accelerator to handle pointer referencing and dereferencing. A hardware accelerator is generated to perform pipelined processing of instructions. The number of stages implemented for pipelined processing is at least partially dependent on the latency associated with accessing secondary components.

Abstract: Methods and apparatus are provided for implementing a programmable device including a processor core and a hardware accelerator. A portion of a program written in a high-level language is automatically selected for hardware acceleration. Dedicated ports are generated to allow the hardware accelerator to handle pointer referencing and dereferencing. Profiling information is used to optimize selection of code for hardware acceleration.

Abstract: Methods and apparatus are provided for interconnecting primary components with secondary components on a programmable chip. Control, data, and address lines are automatically generated to connect primary components and secondary components with an interconnection module. The interconnection connection module manages interaction between primary components and secondary components and provides support for fixed latency and variable latency secondary components.

Abstract: Methods and apparatus are provided for efficiently generating test components for testing and evaluating a design under test. As a design is being configured, generated test components are made available. In one example, test components are automatically generated and included in a simulation testbench based on selected components in the design. Generally, the test components complement the selected components in the design. Moreover, the test components can be automatically seeded with initial contents.

Abstract: Methods and apparatus are provided for efficiently generating test components for testing and evaluating a design under test. As a design is being configured, generated test components are made available. In one example, test components are automatically generated and included in a simulation testbench based on selected components in the design. Generally, the test components complement the selected components in the design. Moreover, the test components can be automatically seeded with initial contents.

Abstract: Methods and apparatus are provided for interconnecting on-chip components, such as components on a programmable chip, with off-chip components through a variety of buses, fabrics, and input/output lines. Interconnection resources such as input/output lines are shared for communication with different off-chip components such as memory. Control circuitry and an arbitration fabric are provided to further improve communication efficiency between on-chip and off-chip components.