Patents by Inventor Togo MATSUI

Togo MATSUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8795454
    Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: August 5, 2014
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
  • Publication number: 20140096890
    Abstract: A method for manufacturing a laminated ceramic electronic component, which includes the steps of preparing a laminate chip having opposed end edges of internal electrodes exposed at opposed side surfaces of the laminate chip; forming a first insulator section and a second insulator section, respectively, on opposed side surfaces of the laminate chip by pressing against a metal plate with a volume of grooves filled with a paste, and swinging the metal plate in any direction when pulling the laminate chip away from the metal plate; and firing the laminate chip with the first insulator section and second insulator section formed thereon. The paste has a viscosity of 500 Pa·s to 2500 Pa·s, and a content C (vol %) of an inorganic solid satisfies a predetermined condition.
    Type: Application
    Filed: December 13, 2013
    Publication date: April 10, 2014
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Kenichi Hamanaka, Eiji Ito, Yasuharu Yamashita, Kenichi Okajima, Togo Matsui
  • Publication number: 20130340920
    Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.
    Type: Application
    Filed: August 29, 2013
    Publication date: December 26, 2013
    Applicant: Murata Manufacturing Co., Ltd.
    Inventors: Togo MATSUI, Minoru DOOKA, Hiroyoshi TAKASHIMA, Kenichi OKAJIMA
  • Patent number: 8584332
    Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: November 19, 2013
    Assignee: Murata Manufacturing Co., Ltd.
    Inventors: Togo Matsui, Minoru Dooka, Hiroyoshi Takashima, Kenichi Okajima
  • Publication number: 20130276955
    Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.
    Type: Application
    Filed: June 12, 2013
    Publication date: October 24, 2013
    Inventors: Togo MATSUI, Minoru DOOKA, Hiroyoshi TAKASHIMA, Kenichi OKAJIMA
  • Publication number: 20120233828
    Abstract: In a manufacturing method for a monolithic ceramic electronic component, a ceramic paste is applied by using an application plate to a side surface of each of a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block. In the applying step, the ceramic paste is transferred to the side surface by moving the green chips and the application plate relative to each other in the direction in which the side surface extends while separating the green chips from the application plate, in a state where the ceramic paste is connected to both the green chips and the application plate.
    Type: Application
    Filed: March 13, 2012
    Publication date: September 20, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Togo MATSUI, Minoru DOOKA, Hiroyoshi TAKASHIMA, Kenichi OKAJIMA
  • Publication number: 20120234462
    Abstract: In a manufacturing method for a monolithic ceramic electronic component, a plurality of green chips arrayed in row and column directions which are obtained after cutting a mother block are spaced apart from each other and then tumbled, thereby uniformly making the side surface of each of the green chips an open surface. Thereafter, an adhesive is applied to the side surface. Then, by placing a side surface ceramic green sheet on an affixation elastic body, and pressing the side surface of the green chips against the side surface ceramic green sheet, the side surface ceramic green sheet is punched and stuck to the side surface.
    Type: Application
    Filed: March 13, 2012
    Publication date: September 20, 2012
    Applicant: MURATA MANUFACTURING CO., LTD.
    Inventors: Togo MATSUI, Minoru DOOKA, Hiroyoshi TAKASHIMA, Kenichi OKAJIMA