Patents by Inventor Toh K. Seng

Toh K. Seng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Underfill applications using film technology
    Patent number: 6514797
    Abstract: A method and apparatus are provided for assembling a semiconductor package. The invention uses a thin release film placed over package components in a mold cavity. The release film is drawn down over the assembled components and envelops the assembled components with an airtight seal around at least three sides for assisting and defining the flow of encapsulant into empty space between components. A mold compound is flowed into the empty space, assisted by vacuum or air pressure at the airtight seal. The release film is pulled up and away from the assembled components, permitting encapsulant to flow into the remainder of the mold cavity.
    Type: Grant
    Filed: March 15, 2001
    Date of Patent: February 4, 2003
    Assignee: Micron Technology, Inc.
    Inventors: Tay L. Chee, Toh K. Seng, Tan K. Chua
  • Underfill applications using film technology
    Publication number: 20020130401
    Abstract: A method and apparatus are provided for assembling a semiconductor package. The invention uses a thin release film placed over package components in a mold cavity. The release film is drawn down over the assembled components and envelops the assembled components with an airtight seal around at least three sides for assisting and defining the flow of encapsulant into empty space between components. A mold compound is flowed into the empty space, assisted by vacuum or air pressure at the airtight seal. The release film is pulled up and away from the assembled components, permitting encapsulant to flow into the remainder of the mold cavity.
    Type: Application
    Filed: March 15, 2001
    Publication date: September 19, 2002
    Inventors: Tay L. Chee, Toh K. Seng, Tan K. Chua