Patents by Inventor Toh Peng Seng

Toh Peng Seng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20110138711
    Abstract: This invention generally relates to an integrated photovoltaic roof assembly for constructing a building integrated photovoltaic system commonly known as BIPV. The invention enables the photovoltaic panels to serve as a water proof envelop of a building while generating electricity from the sun. The photovoltaic roof assembly consists of a plurality of solar panels fitted to a lattice mounting structure comprises of perpendicularly interconnected profiles with flushed surfaces and built-in gutters. There are few components required and no restriction on the gradient of the roof. Neither skilled labor nor special tool such as welding is required for installing the integrated photovoltaic roof assembly.
    Type: Application
    Filed: November 19, 2010
    Publication date: June 16, 2011
    Inventors: Toh Peng SENG, Teo Kian Lip
  • Patent number: 6084663
    Abstract: A method and apparatus for inspecting a printed circuit board assembly especially with surface mount devices are provided. The method and apparatus include a multiple camera set-up utilizing both color and monochrome images. A very strong white light is employed as the light source. The multiple camera setup includes frontal and oblique looking cameras to examine the printed circuited board assembly from different angles. The strong white light source provides sufficient illumination evan at a small camera aperture hence increasing the depth of field. The method and apparatus are resistant against warpage of the PCB and variations in components' height.
    Type: Grant
    Filed: April 7, 1997
    Date of Patent: July 4, 2000
    Assignee: Hewlett-Packard Company
    Inventor: Toh Peng Seng
  • Patent number: 5940566
    Abstract: This is an invention related to an apparatus for non-contact displacement measurement over an area. The apparatus is suitable for a small dynamic range with extremely high sensitivity. The area of measurement can be reconfigured as image processing technique is employed. The sensor is small and light in size.
    Type: Grant
    Filed: October 23, 1997
    Date of Patent: August 17, 1999
    Assignee: Hewlett-Packard Company
    Inventor: Toh Peng Seng
  • Patent number: 5880844
    Abstract: A method and apparatus are provided that measure object height and volume using a combination of and optical means and image processing techniques. The method includes multiple imaging paths with different object distance viewing the same field of view of the object. Image processing techniques are used to determine the degrees-of-focus of features of the images captured from the different imaging paths. Height of the features of the object is determined by the difference in the degrees-of-focus on different images. The object volume is calculated from the height of its features.
    Type: Grant
    Filed: April 9, 1997
    Date of Patent: March 9, 1999
    Assignee: Hewlett-Packard Company
    Inventor: Toh Peng Seng