Patents by Inventor Toh Sean

Toh Sean has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Ball grid array solder joint reliability
    Publication number: 20050269699
    Abstract: An apparatus and system are provided for improving ball grid array (BGA) joint reliability. According to one embodiment, a ball grid array (BGA) package having a first and second surface and an array of solder balls to align the first surface with the second surface is disclosed. The first surface is coupled to an integrated circuit (IC) device and the second surface is coupled to a printed circuit board (PCB). A bonder is applied between the first surface and second surface independently of the array of solder balls.
    Type: Application
    Filed: August 9, 2005
    Publication date: December 8, 2005
    Inventors: Tan Haw, Toh Sean, Ho Cheng