Abstract: A method is disclosed for detecting a contact position between an object under measurement and measuring pins. A semiconductor test device issues an instruction to a wafer prober control unit to control raising and down of a stage. When raising the stage in units of a predetermined distance a and detecting that the number of probe pins in contact with a wafer is equal to or greater than a constant value; the semiconductor test device lowers the stage in units of the predetermined distance a. When the number of contacted pins are less than the constant value, the device again raises the stage in units of a predetermined distance b smaller than the predetermined distance a; whereas, when the number of contacted pins is equal to or greater than the constant value, the device treats the position of the stage at that time as a first touch position.