Patents by Inventor Tohru Fujinawa

Tohru Fujinawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8696942
    Abstract: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
    Type: Grant
    Filed: June 12, 2012
    Date of Patent: April 15, 2014
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeki Katogi, Hiroyuki Izawa, Houko Sutou, Masami Yusa, Tohru Fujinawa
  • Patent number: 8558118
    Abstract: The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
    Type: Grant
    Filed: April 29, 2010
    Date of Patent: October 15, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Motohiro Arifuku, Nichiomi Mochizuki, Takashi Nakazawa, Kouji Kobayashi, Tohru Fujinawa, Takashi Tatsuzawa
  • Patent number: 8541688
    Abstract: The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
    Type: Grant
    Filed: April 29, 2010
    Date of Patent: September 24, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Motohiro Arifuku, Nichiomi Mochizuki, Takashi Nakazawa, Kouji Kobayashi, Tohru Fujinawa, Takashi Tatsuzawa
  • Patent number: 8518303
    Abstract: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane(meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
    Type: Grant
    Filed: March 15, 2006
    Date of Patent: August 27, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Shigeki Katogi, Hiroyuki Izawa, Houko Sutou, Masami Yusa, Tohru Fujinawa
  • Patent number: 8497431
    Abstract: The circuit-connecting material for connection between circuit members each having a board and a circuit electrode formed on the primary surface of the board, comprising an adhesive composition that cures in response to light or heat and an organic compound containing a urethane group and an ester group.
    Type: Grant
    Filed: July 21, 2006
    Date of Patent: July 30, 2013
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Motohiro Arifuku, Nichiomi Mochizuki, Takashi Nakazawa, Kouji Kobayashi, Tohru Fujinawa, Takashi Tatsuzawa
  • Publication number: 20120273974
    Abstract: The adhesive composition of the invention comprises a radical generator, a thermoplastic resin and a urethane (meth)acrylate having two or more radical-polymerizing groups in the molecule and a weight-average molecular weight of 3000-30,000.
    Type: Application
    Filed: June 12, 2012
    Publication date: November 1, 2012
    Applicant: HITACHI CHEMICAL CO., LTD.
    Inventors: Shigeki Katogi, Hiroyuki Izawa, Houko Sutou, Masami Yusa, Tohru Fujinawa
  • Publication number: 20120138868
    Abstract: The circuit connecting material of the invention is situated between mutually opposing circuit electrodes, and provides electrical connection between the electrodes in the pressing direction when the mutually opposing circuit electrodes are pressed, the circuit connecting material comprising anisotropic conductive particles wherein conductive fine particles are dispersed in an organic insulating material.
    Type: Application
    Filed: April 22, 2010
    Publication date: June 7, 2012
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Motohiro Arifuku, Kouji Kobayashi, Tohru Fujinawa
  • Publication number: 20120097902
    Abstract: The anisotropic conductive particles of the invention have conductive fine particles 2 dispersed in an organic insulating material 3.
    Type: Application
    Filed: April 22, 2010
    Publication date: April 26, 2012
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Motohiro Arifuku, Kouji Kobayashi, Tohru Fujinawa
  • Publication number: 20120085579
    Abstract: An adhesive composition comprising: an adhesive component, conductive particles and insulating particles, wherein the ratio of the mean particle size of the insulating particles Ri to the mean particle size of the conductive particles Rc (Ri/Rc) is 120 to 300%.
    Type: Application
    Filed: December 14, 2006
    Publication date: April 12, 2012
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Takashi Tatsuzawa, Kouji Kobayashi, Tohru Fujinawa, Naoki Fukushima
  • Patent number: 8142605
    Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
    Type: Grant
    Filed: January 25, 2011
    Date of Patent: March 27, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Patent number: 8120189
    Abstract: A wiring structure having a wiring-terminal-connection adhesive that includes a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles.
    Type: Grant
    Filed: June 13, 2008
    Date of Patent: February 21, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Motohiro Arifuku, Itsuo Watanabe, Kouji Motomura, Kouji Kobayashi, Yasushi Gotoh, Tohru Fujinawa
  • Patent number: 8115322
    Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.
    Type: Grant
    Filed: September 2, 2010
    Date of Patent: February 14, 2012
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Motohiro Arifuku, Itsuo Watanabe, Kouji Motomura, Kouji Kobayashi, Yasushi Gotoh, Tohru Fujinawa
  • Publication number: 20120015126
    Abstract: A bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has a region in which an adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and an end tape which is bonded to the terminal end of the tape for circuit connection so as to cover the region, and extends toward the core from the terminal end.
    Type: Application
    Filed: March 12, 2010
    Publication date: January 19, 2012
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Takashi Tatsuzawa, Takashi Seki, Kouji Kobayashi, Tohru Fujinawa, Motohiro Arifuku, Kotaro Seki
  • Publication number: 20110300326
    Abstract: The bonding-material reel according to the present invention includes a tape for circuit connection having a tape-shaped base material and an adhesive layer formed on one surface of the base material, and a core around which the tape for circuit connection is wound, wherein the tape for circuit connection has an end tape which has been bonded to the terminal end, a region in which the adhesive layer is not formed over at least one reel length of the core toward the start end of the tape for circuit connection from the terminal end thereof, and a cover tape which is provided so as to cover the region.
    Type: Application
    Filed: February 24, 2010
    Publication date: December 8, 2011
    Applicant: HITACHI CHEMICAL COMPANY, LTD.
    Inventors: Takashi Tatsuzawa, Takashi Seki, Kouji Kobayashi, Tohru Fujinawa, Motohiro Arifuku, Kotaro Seki
  • Patent number: 8029911
    Abstract: There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.
    Type: Grant
    Filed: July 30, 2010
    Date of Patent: October 4, 2011
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Satoyuki Nomura, Tohru Fujinawa, Hiroshi Ono, Hoko Kanazawa, Masami Yusa
  • Patent number: 7967943
    Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) a radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
    Type: Grant
    Filed: September 16, 2005
    Date of Patent: June 28, 2011
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atushi Kuwano
  • Patent number: 7968196
    Abstract: A circuit-connecting material interposed between mutually-facing circuit electrodes, and electrically connecting the electrodes, either by direct contact, or via conductive particles present in the material. The circuit-connecting material features: (1) a curing agent capable of generating free radicals upon heating; (2) a radical-polymerizable substance, and two or more microscopically separated phases. The two or more microscopically separated phases include an elastomer phase of carboxyl-group-containing elastomer and a phenoxy resin phase of a phenoxy resin having a weight average molecular weight of 10,000 or more.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: June 28, 2011
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Publication number: 20110114893
    Abstract: A circuit-connecting material which is interposed between circuit electrodes facing each other and electrically connects the electrodes in the pressing direction by pressing the facing electrodes against each other; the circuit-connecting material comprising as essential components (1) a curing agent capable of generating free radicals upon heating, (2) a hydroxyl-group-containing resin having a molecular weight of 10,000 or more and (3) radical-polymerizable substance. Also provided are a circuit terminal connected structure and a circuit terminal connecting method which make use of such a material.
    Type: Application
    Filed: January 25, 2011
    Publication date: May 19, 2011
    Applicant: HITACHI CHEMICAL CO., LTD.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Patent number: 7879956
    Abstract: A circuit-connecting material for interposing between circuit electrodes facing each other and electrically connecting the electrodes, after curing by heat and pressure, either by direct contact or via conductive particles present in the material. The circuit-connecting material features the following essential components: (1) a curing agent capable of generating free radicals upon heating, (2) a phenoxy resin having a weight average molecular weight of 10,000 or more, and that is chemically modified by a carboxyl-group-containing elastomer, and (3) a radical-polymerizable substance.
    Type: Grant
    Filed: August 20, 2007
    Date of Patent: February 1, 2011
    Assignee: Hitachi Chemical Company, Ltd.
    Inventors: Itsuo Watanabe, Tohru Fujinawa, Motohiro Arifuku, Houko Kanazawa, Atsushi Kuwano
  • Publication number: 20100330364
    Abstract: This invention provides a wiring-terminal-connecting adhesive comprising a curing agent capable of generating a free radical upon heating, a radically polymerizable substance and silicone particles, and a wiring-terminal-connecting method and a wiring structure which make use of such an adhesive.
    Type: Application
    Filed: September 2, 2010
    Publication date: December 30, 2010
    Inventors: Motohiro ARIFUKU, Itsuo WATANABE, Kouji MOTOMURA, Kouji KOBAYASHI, Yasushi GOTOH, Tohru FUJINAWA