Patents by Inventor Tohru Inagaki

Tohru Inagaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Vehicle seat
    Patent number: 11787321
    Abstract: The vehicle seat includes a seat back 2 having a support surface 11, a recessed portion 28 that is provided on a back surface 12 of the seat back 2 opposite to the support surface 11 and formed to be recessed from the back surface 12 toward the inside of the seat back 2, and a socket 7 provided inside the recessed portion 28, to which an external device is connected, and which is provided on a surface inclined to face upward with respect to the back surface 12 of the seat back 2. The back surface 12 of the seat back 2 is provided with a socket housing 6 that is attached to a skin 13 of the seat back 2 and is formed to be recessed toward the inside of the seat back 2. A space inside the socket housing 6 is the recessed portion 28.
    Type: Grant
    Filed: January 24, 2022
    Date of Patent: October 17, 2023
    Assignee: HONDA MOTOR CO., LTD.
    Inventors: Tohru Inagaki, Takumi Sato
  • VEHICLE SEAT
    Publication number: 20220242291
    Abstract: The vehicle seat includes a seat back 2 having a support surface 11, a recessed portion 28 that is provided on a back surface 12 of the seat back 2 opposite to the support surface 11 and formed to be recessed from the back surface 12 toward the inside of the seat back 2, and a socket 7 provided inside the recessed portion 28, to which an external device is connected, and which is provided on a surface inclined to face upward with respect to the back surface 12 of the seat back 2. The back surface 12 of the seat back 2 is provided with a socket housing 6 that is attached to a skin 13 of the seat back 2 and is formed to be recessed toward the inside of the seat back 2. A space inside the socket housing 6 is the recessed portion 28.
    Type: Application
    Filed: January 24, 2022
    Publication date: August 4, 2022
    Inventors: Tohru Inagaki, Takumi Sato